WMSIC Electronic Components

MOLEX 0525590853

Model0525590853
BrandMOLEX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 139370

Availability on request

Technical data

Product details

20 specifications

Core information

Product name
MOLEX 0525590853
Type
MOLEX
Unit
Electronic Component
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MOLEX
Electronic Component
0525590853
Electronic Component
1
Electronic Component
(ZIF)
Electronic Component
Solder
Electronic Component
0g
Electronic Component
0.020"(0.50mm)
Electronic Component
1
Electronic Component
8
Electronic Component
BM0265828296
Housing
(PA46), 4 / 6
Type
Surface Mount
Operating Temperature
40°C ~ 85°C
Electronic Component
0.154"(3.90mm)

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MOLEX 0525590853 FFC/FPC连接器产品概述

一、产品基本定位

MOLEX 0525590853是一款专为小型化电子设备设计的表面贴装(SMD)FFC/FPC连接器,针对8位、0.50mm间距的柔性电路连接需求,集成零插入力(ZIF)、滑锁锁定等核心特性,兼顾电气性能、机械可靠性与空间效率,广泛适配消费电子、汽车、工业及医疗等领域的紧凑布局应用。

二、核心技术参数梳理

1. 电气与环境参数

  • 额定电压:50V AC/DC,满足中低功率信号与电源传输需求;
  • 工作温度:-40℃至85℃,覆盖工业级与消费电子的典型环境温度区间;
  • 阻燃等级:UL94 V-0,具备优异的阻燃性能,符合安全规范要求。

2. 机械与安装参数

  • 针位数:8位,适配8线柔性电缆;
  • 间距:0.50mm(0.020"),属于高密度柔性连接标准间距;
  • 板上高度:3.90mm(0.154"),SMD安装方式节省PCB空间;
  • FFC兼容性:适配厚度0.30mm的柔性电缆,电缆端支持直形/锥形两种类型;
  • 端接方式:焊接端接,确保PCB与连接器的稳定电气连接。

3. 材料与结构参数

  • 触头:磷青铜基底+镀金表面处理,提升接触可靠性与耐腐蚀性;
  • 外壳:聚酰胺(PA46),具备高耐热性与机械强度;
  • 致动器:聚苯硫醚(PPS),耐化学性与尺寸稳定性优异;
  • 锁定功能:滑锁式设计,插入后自动锁定,防止振动/外力导致的连接松动。

三、设计特点与关键优势

1. ZIF设计降低装配损耗

零插入力(ZIF)结构配合滑锁致动器,使FFC/FPC插入时无需施加额外大外力,避免柔性电缆褶皱、断裂或触头弯曲损伤,尤其适合自动化装配线,提升生产效率与良率。

2. 镀金触头保障电气稳定性

磷青铜触头采用镀金表面处理,有效降低接触电阻(典型值满足信号传输要求),同时提升耐磨损、防氧化与抗腐蚀能力,确保长期使用中信号无衰减、连接可靠。

3. 耐高温材料适配恶劣环境

外壳PA46与致动器PPS均具备优异的耐高温性能,可在85℃工作温度下稳定运行;PA46的机械强度与PPS的耐化学性,使其能承受振动、冲击及轻度化学侵蚀,适配汽车、工业等严苛场景。

4. 紧凑尺寸满足小型化需求

0.50mm间距与3.90mm板上高度的SMD设计,极大节省PCB布局空间,适配智能手机、智能穿戴、便携式医疗设备等对尺寸敏感的应用;焊接端接方式便于自动化贴装。

四、典型应用场景

1. 消费电子领域

  • 智能手机/平板:内部柔性电路与主板连接(屏幕排线、电池排线);
  • 智能穿戴:智能手表/手环的传感器与主板连接,适配紧凑内部空间。

2. 汽车电子领域

  • 小型传感器:胎压监测、座椅传感器的柔性连接,满足汽车级温度与振动要求;
  • 车载系统:中控面板与主机的柔性排线连接。

3. 工业控制领域

  • 小型PLC:I/O模块的柔性信号连接,适配工业环境温度范围;
  • 机器人末端:柔性电缆与控制板的连接,承受机械振动。

4. 医疗设备领域

  • 便携式仪器:血糖仪、血压计的内部柔性连接,符合安全与可靠性要求。

五、可靠性与合规性

  • 阻燃性能:UL94 V-0等级,可有效阻止火焰蔓延,提升设备安全性;
  • 触头可靠性:镀金表面处理通过多次插拔测试(典型次数≥500次),无接触不良问题;
  • 环境适应性:-40℃至85℃的工作温度范围,覆盖全球多数地区的使用环境,无需额外温控设计。

该产品凭借高集成度、可靠性与空间效率,成为小型化电子设备柔性连接的优选方案,适配多行业的多样化需求。

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