WMSIC Electronic Components

MOLEX 0022272081

Model0022272081
BrandMOLEX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 139373

Availability on request

Technical data

Product details

20 specifications

Core information

Product name
MOLEX 0022272081
Type
MOLEX
Unit
Electronic Component
Minimum package
475 袋

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MOLEX
Electronic Component
0022272081
Electronic Component
1
Electronic Component
1
Electronic Component
1
Electronic Component
to
Electronic Component
Solder
Electronic Component
0g
Electronic Component
1
Electronic Component
8
Electronic Component
BM0265985605
Type
Electronic Component
Type
Electronic Component
Electronic Component
(PA)

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MOLEX 0022272081 板至电缆/导线连接器产品概述

MOLEX 0022272081是一款针对PCB板与电缆/导线连接设计的通孔焊接式连接器,属于行业通用2.54mm间距系列,凭借成熟结构、可靠性能及通用规格,广泛应用于多领域电子设备。

一、产品定位与基本属性

该产品为单排8位公形引脚连接器,核心定位是实现板端与电缆的稳定电连接,适配中低功率、中复杂度设备。作为MOLEX标准款,遵循2.54mm(0.100")间距规范,采用通孔焊接安装,紧固方式为摩擦锁,是兼顾成本与可靠性的基础连接器件。

二、核心规格参数明细

关键参数梳理如下:

  • 机械规格:间距2.54mm,1排8位全针加载;配接触头长度7.49mm(0.295"),焊接柱端长度3.56mm(0.140"),总体接触长度14.22mm(0.560");绝缘高度11.70mm(0.461"),带1墙遮蔽护罩。
  • 材料与表面处理:触头为黄铜材质,配接端及焊接端均镀锡(厚度100.0µin/2.54µm);绝缘材料为聚酰胺(PA,尼龙),颜色为天然色,可燃性等级达UL94 V-0。
  • 安装与端接:通孔安装,焊接端接,紧固依赖摩擦锁结构(配接时实现可靠锁定)。

三、设计特点与工艺优势

该连接器设计聚焦可靠性、易安装性及环境适应性,核心特点包括:

  1. 摩擦锁紧固:无需额外工具即可完成插拔,同时有效防止振动或外力导致的脱开,提升连接稳定性;
  2. 1墙遮蔽护罩:在触头外侧设置单墙护罩,既避免灰尘、油污等异物侵入,降低接触不良风险,又能防止操作时误触带电触头,提升安全性;
  3. 锡镀层触头:均匀镀锡(2.54µm厚)兼具优异焊接性(焊点牢固)与接触导电性(接触电阻低),同时增强抗腐蚀能力;
  4. 尼龙绝缘:UL94 V-0阻燃尼龙,耐温范围宽(-40℃~105℃),机械强度高(耐冲击、抗弯曲),绝缘性能稳定;
  5. 方形触头:相比圆形触头提供更稳定的接触面积,减少接触电阻波动,提升电连接可靠性。

四、典型应用场景

因规格通用、性能可靠,该连接器适用于以下场景:

  • 消费电子:小家电(加湿器、智能台灯)、遥控器等低成本连接需求;
  • 工业控制:小型PLC模块、传感器节点、低压配电单元(依赖阻燃性与抗振性);
  • 通信设备:基站附属模块(电源分配单元)、光纤收发器辅助接口(适配2.54mm通用间距);
  • 医疗设备:小型诊断仪器(血糖仪、血压计)内部连接(符合安全规范)。

五、性能与可靠性表现

从实际应用验证看,该连接器具备以下可靠性能:

  • 电性能:触头黄铜+锡镀层组合,接触电阻典型值<20mΩ,适配<1A/位中低功率需求;
  • 机械性能:摩擦锁结构可承受至少100次插拔(行业标准),绝缘材料耐冲击强度达10J以上;
  • 环境性能:UL94 V-0阻燃通过测试,可在-40℃~85℃长期稳定工作,防潮、防盐雾符合GB/T 2423标准;
  • 安装性能:通孔焊接工艺成熟,PCB焊盘间距匹配2.54mm,兼容多数标准PCB设计,批量生产效率高。

六、选型与搭配建议

  1. 母端搭配:建议选择MOLEX同系列2.54mm间距、1排8位母形接头(如0039300081),确保配接兼容性;
  2. PCB设计:焊盘间距需控制在2.54mm±0.1mm,焊盘孔径建议0.8mm~1.0mm(适配柱端直径),绝缘高度11.70mm需避免与周围元件干涉;
  3. 环境限制:避免长期超105℃或接触强腐蚀性气体(如硫化氢),若需更高防护可搭配额外护套。

总结

MOLEX 0022272081是一款高性价比通用型板端连接器,核心优势在于规格通用、安装简便、性能可靠,同时兼顾成本控制。无论是消费电子的量产需求,还是工业控制的稳定要求,均能提供适配的连接解决方案,是电子设备设计中常见的基础连接选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.