WMSIC Electronic Components

MEIHUA MHPA2121URGBDT

ModelMHPA2121URGBDT
PackageSMD,2.1x2.1mm
BrandMEIHUA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MEIHUA MHPA2121URGBDT
Type
MEIHUA
Minimum package
17000 编带

Technical parameters

Power
R:40mW;G:45mW;B:45mW
Electronic Component
Electronic Component
Electronic Component
MEIHUA
Electronic Component
MHPA2121URGBDT
Electronic Component
1
Electronic Component
2.1mm
Package
SMD,2.1x2.1mm
Electronic Component
G:522nm~530nm;R:618nm~628nm;B:463nm~471nm
Electronic Component
RGB LED
Electronic Component
0.025g
Electronic Component
2.1mm
Electronic Component
1mm
Electronic Component
1
LED
G:160mcd~270mcd;R:55mcd~93mcd;B:19mcd~31.8mcd
LED
110°
Electronic Component
BM0228538221

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MHPA2121URGBDT 产品概述

一、产品简介

MHPA2121URGBDT 是美华(MEIHUA)出品的一款共阳极 RGB 发光二极管,采用小尺寸 SMD 封装(2.1 × 2.1 mm)、低高度(1 mm)和黑色雾状透镜设计。器件集成红、绿、蓝三色发光单元,便于在有限空间内实现全彩显示与指示。封装小巧、视角宽、对比度好,适合集成在消费电子、仪表面板、指示灯和微型背光等应用场景。

二、主要电气与光学参数

  • 配置:共阳极(Common Anode)
  • 正向电流(If):R: 25 mA;G: 20 mA;B: 20 mA(推荐不超过额定值)
  • 正向压降(Vf):R: 1.7 V ~ 2.5 V;G: 2.5 V ~ 3.1 V;B: 2.5 V ~ 3.1 V
  • 最大功率(每色):R: 40 mW;G: 45 mW;B: 45 mW
  • 峰值波长:R: 618 nm ~ 628 nm;G: 522 nm ~ 530 nm;B: 463 nm ~ 471 nm
  • 发光强度(Iv):R: 55 mcd ~ 93 mcd;G: 160 mcd ~ 270 mcd;B: 19 mcd ~ 31.8 mcd
  • 发光角度:110°
  • 抗静电能力:R: 2000 V;G: 1000 V;B: 1000 V
  • 工作温度范围:-40 ℃ ~ +85 ℃

三、封装与机械特性

  • 封装形式:SMD(表贴封装)
  • 外形尺寸:2.1 × 2.1 mm(长 × 宽)
  • 高度:1 mm(低高度设计,适合紧凑结构)
  • 透镜颜色:黑色雾状透镜(提高高亮环境下的对比度与可视性)
  • 引脚结构:共阳极结构常见为四引脚布局(共阳 + R/G/B 三个阴极),便于与低端驱动或 MCU/PWM 驱动器配合使用。

四、驱动与设计建议

  • 共阳极驱动:将共阳极接到正电源(如 Vcc),通过对各色阴极进行低端开关或 PWM 调制实现亮度与色彩控制。每色需串联限流电阻或恒流驱动器以稳定电流。
  • 限流电阻计算示例(仅供参考):若 Vcc = 5 V,目标 If = 20 mA(绿色/蓝色),取 Vf = 3.0 V,则 R = (5.0 - 3.0) / 0.02 = 100 Ω。实际设计应按最差 Vf 与所需亮度余量调整。
  • PWM 调光:建议 PWM 频率 > 200 Hz 以避免肉眼可见闪烁;若用于图像显示或视频同步应选择更高频率(数 kHz)。
  • 热管理与功率:按单色最大功率限制及 PCB 散热条件控制平均电流,避免长期满流工作导致器件老化或亮度衰减。

五、可靠性与使用注意

  • ESD 防护:三色抗静电等级不一致,红色达 2000 V,绿/蓝色为 1000 V。建议在生产与装配环节采取静电防护(接地手环、防静电工作台)并在电路中加入必要的保护元件。
  • 温度与环境:器件工作温度范围宽(-40 ~ +85 ℃),适用于一般室内及车载、工业等较严苛环境,但应避免长期在极端高温或湿度条件下工作以延长寿命。
  • PCB 布局:建议在 SMD 封装周围保留适当的铜面积以帮助散热,走线尽量短且尽量避免直接在发光区上放置遮挡物以免影响出光角与亮度。

六、典型应用

  • 指示灯与状态显示(面板指示、设备指示灯)
  • 小型背光与按键指示(便携设备、遥控器、家用器具)
  • 装饰与气氛照明(微型氛围灯、可编程灯带)
  • 仪器仪表与消费电子中的多色提示

总体而言,MHPA2121URGBDT 以其小尺寸、低矮高度、共阳结构和均衡的光学特性,在需要体积受限且要求多色指示或简单全彩显示的场景中具备良好的设计适配性。设计时应重视限流、散热与 ESD 防护以确保稳定可靠的长期工作。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.