WMSIC Electronic Components

MEIHUA MHL312IR039CRT

ModelMHL312IR039CRT
PackageTHT,D=3MM
BrandMEIHUA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MEIHUA MHL312IR039CRT
Type
THT, D=3MM
Minimum package
1000 袋

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MEIHUA
Electronic Component
MHL312IR039CRT
Electronic Component
1
Package
Through-hole, D=3mm
Electronic Component
940nm
Electronic Component
Infrared Emitter
Electronic Component
30°
Electronic Component
0.12g
Electronic Component
1
Electronic Component
BM0226069616
Operating Temperature
25℃~+85℃
Current
20mA;100mA
Electronic Component
15mW/sr;75mW/sr
(Vf)
1.3V~1.8V
Power Dissipation(Pd)
150mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MHL312IR039CRT 产品概述

一、主要参数概览

MHL312IR039CRT 是美华(MEIHUA)生产的一款 3mm 插件红外发射二极管,面向红外遥控与近距离光通信等应用场景。主要参数如下:

  • 波长(λ):940 nm(典型,近红外)
  • 正向电流:典型工作 20 mA;允许脉冲峰值 100 mA(需按脉冲条件限制)
  • 正向压降(Vf):1.3 V ~ 1.8 V(与电流和温度相关)
  • 辐射强度:15 mW/sr ~ 75 mW/sr(按光强分档,需按具体料号/批次确认)
  • 视角(半角):30°(束宽较窄,指向性好)
  • 直流反向耐压(Vr):5 V(禁止在使用中施加超过此反向电压)
  • 耗散功率(Pd):150 mW
  • 工作温度范围:-25 ℃ ~ +85 ℃
  • 封装:插件,直径 D = 3 mm(常见 THT 形式)

二、光电特性与热限

MHL312IR039CRT 在 940 nm 波段有较高的红外输出,适合常见的红外接收器(如 TSOP 系列)匹配。辐射强度给出 15 mW/sr 到 75 mW/sr 的范围,表示存在不同光强等级(binning),选型时应确认目标光强以满足接收灵敏度或照射距离要求。

热和功率方面需要注意:

  • 二极管瞬时功率 P ≈ Vf × If。按典型 Vf = 1.5 V、If = 20 mA 时,耗散约 30 mW,远低于 Pd(150 mW),适合连续工作。
  • 若用 100 mA 脉冲驱动,P ≈ 1.5 V × 0.1 A = 150 mW,已接近标称耗散上限,故 100 mA 仅适合短脉冲并受限于占空比与脉宽,否则会导致结温迅速上升并损坏器件。
  • 反向电压 Vr = 5 V,平常电路中应避免反向偏置(或使用限压/保护元件)。

三、封装与机械特性

3mm 插件封装便于手工焊接与面向小批量装配或原型设计。30°视角使得光束较集中,适用于需要定向照射或较长工作距离的应用。物理安装简单,但应注意管脚弯折与焊接热对器件的影响。

四、典型应用场景

  • 遥控发射(电视/家电遥控、红外链路)
  • 红外距离/接近传感(配合光电接收器做障碍检测)
  • 红外通信(短距离数据传输)
  • 夜视/安防照明(与接收侧配合)
  • 工业光电隔离与传感器发射端

五、驱动与电路建议

  • 常用驱动方式:电流限制电阻或恒流驱动。若由 MCU 直接驱动,需确保 MCU 引脚能承受 If(通常 20 mA)并设置合适电阻。
  • 串联电阻计算示例:
    假设 Vf = 1.5 V,目标 If = 20 mA。
    • 供电 5 V:R = (5.0 - 1.5) / 0.02 ≈ 175 Ω → 标准值 180 Ω。
    • 供电 3.3 V:R = (3.3 - 1.5) / 0.02 ≈ 90 Ω → 标准值 91 Ω 或 82 Ω(视允许误差)。
  • 高电流脉冲(如 100 mA)应由开关晶体管或 MOSFET 驱动,MCU 引脚只能作为驱动信号。脉冲时严格限制脉宽与占空比(建议短脉冲、低占空比),并增加散热余量。
  • 加入反向/过压保护:在可能出现反向或浪涌的环境中,考虑串联二极管或 TVS 保护。

六、安装、可靠性与注意事项

  • 焊接:插件件焊接时避免过高温度和过长时间接触,可遵循通用 THT 焊接规范(避免直接给器件带来过大热应力)。如需回流或波峰焊,严格参考制造商的焊接工艺说明。
  • ESD:红外 LED 对静电敏感,操作与存储时建议防静电措施。
  • 环境:工作温度 -25 ℃ 至 +85 ℃,高温时光输出与电参数会下降,应考虑对性能的热漂移进行设计余量。
  • 反向电压:切勿超过 5 V,以免产生击穿。

七、选型建议与对比要点

在选择 MHL312IR039CRT 时,关注以下几点:

  • 光强档位(15~75 mW/sr)是否满足接收端灵敏度与距离需求。
  • 是否需要持续 20 mA 工作或仅短脉冲高流驱动(100 mA);若需要高频大流,考虑封装或热性能更好的器件。
  • 视角 30° 是否与系统的光学布局匹配(窄角度适合指向性应用,若需更广覆盖可选大视角器件)。
  • Vf 范围和工作温度对驱动电路的影响,预留电压/功率余量。

总结:MHL312IR039CRT 以其窄视角、高方向性和典型 940 nm 波段输出,适合绝大多数红外遥控、传感与短距离通信应用。设计时重点关注驱动电流、脉冲条件与散热,依据具体光强需求选择合适的 bin,并遵循焊接与静电防护规范以保证长期可靠性。若需精确的波形、脉冲限制与焊接曲线,请参照厂商完整数据手册。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.