WMSIC Electronic Components

MAXLINEAR SP3222EEA-L/TR SP3222EEA

ModelSP3222EEA-L/TR
PackageSSOP-20
BrandMAXLINEAR
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
MAXLINEAR SP3222EEA-L / TR
Type
MAXLINEAR
Unit
Electronic Component
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MAXLINEAR
Electronic Component
SP3222EEA-L/TR
Electronic Component
1
Package
SSOP-20
Type
Transceiver
Electronic Component
RS232IC
Electronic Component
0.417g
Electronic Component
1
Features
Electronic Component
Electronic Component
BM0230266576
Operating Temperature
40℃~+85℃
Operating Voltage
3V~5.5V
Receiver
2
Data
235Kbps

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SP3222EEA-L/TR 产品概述

SP3222EEA-L/TR 是 MAXLINEAR(迈凌)供应的一款全双工 2 驱动 / 2 接收收发器,针对需在单电源下实现串行电平转换的嵌入式系统与工业应用而设计。器件集成电荷泵,可在 3.0 V 至 5.5 V 的工作电压范围内产生所需的通信电平,具备优秀的静态功耗与抗静电能力,适合电池供电与严苛环境下的长期运行。

一、主要规格亮点

  • 类型:收发器(全双工 2 驱动 / 2 接收)
  • 数据速率:最高可达 235 kbps,满足常见串行链路需求
  • 工作电压:3.0 V ~ 5.5 V(单电源供电)
  • 静态电流:典型 0.3 mA,适合低功耗设计
  • 电荷泵:内置电荷泵,无需负电源即可输出传统串口电平
  • 静电保护:I/O 端口 ESD 抗扰度 ±15 kV(典型值)
  • 工作温度:-40 ℃ ~ +85 ℃(工业级)
  • 封装:SSOP-20,适合集成与量产装配

二、功能与优势

  1. 单芯片实现 RS-232 类电平收发:内置电荷泵削减外部电源复杂度,使器件在单 3 V 电源下即可驱动传统串行接口,便于与 MCU/UART 无缝对接。
  2. 低静态功耗:0.3 mA 的静态电流极大降低待机与空闲时的能耗,适合便携与电池供电设备。
  3. 强抗干扰能力:高达 ±15 kV 的静电防护可提升系统在装配与终端使用过程中的可靠性。
  4. 宽工作电压与工业级温度:支持 3.0–5.5 V 与 -40~+85 ℃,覆盖多种应用场景与环境条件。

三、典型应用场景

  • 工业控制与数据采集终端(采集模块、PLC 扩展)
  • 嵌入式通信接口(单片机与外设间串行链路)
  • POS、仪表与医疗器械等对可靠性与抗静电要求较高的产品
  • 电池供电或低功耗终端(遥控器、便携设备等)

四、设计与布局建议

  • 电荷泵稳定性:按厂家参考设计在电荷泵相关引脚附近布置必要的旁路/泵用电容(参照原厂应用电路),并靠近器件引脚放置,减少寄生阻抗。
  • 电源去耦:在 VCC 处放置 0.1 µF 陶瓷去耦电容并靠近封装,引入必要的滤波以抑制瞬态噪声。
  • PCB 布局:串口线(高电平侧)走线尽量短且远离高频开关源,接收器输入与驱动器输出分区布置以降低串扰。
  • ESD 与接地:在受外界插拔或接触的 I/O 口增加必要的浪涌/浪涌抑制元件,并保证良好的接地平面以便分散冲击能量。

五、封装与采购信息

SP3222EEA-L/TR 以 SSOP-20 小型封装提供,适用于自动贴装生产;型号尾缀 TR 表示卷带盘装(Tape & Reel),便于大批量采购与生产线使用。选型时请留意原厂提供的器件物料单(BOM)与封装方向图,确保焊接与锡膏模板匹配。

总结:SP3222EEA-L/TR 以其内置电荷泵、低静态电流与较高的 ESD 抗扰度,在需单电源驱动传统串行电平、追求低功耗与工业级可靠性的系统中提供了极具吸引力的方案。实际设计时建议参考 MAXLINEAR 的应用说明书与典型电路,以保证电荷泵与去耦布线的最佳实践。

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