WMSIC Electronic Components

MAXLINEAR XR21B1411IL16TR-F XR21B1411IL16TR

ModelXR21B1411IL16TR-F
PackageQFN-16-EP(3x3)
BrandMAXLINEAR
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
MAXLINEAR XR21B1411IL16TR-F
Type
MAXLINEAR
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MAXLINEAR
Electronic Component
XR21B1411IL16TR-F
Electronic Component
1
Package
QFN-16-EP(3x3)
Electronic Component
USB Converter IC
Electronic Component
0.153g
Electronic Component
1
Features
FIFO; Programmable;; Built-in Clock Generator;; Low Power
Electronic Component
BM0000515087
Operating Temperature
40℃~+85℃
Operating Voltage
4.4V~5.25V
Electronic Component
USB UART
Data
12Mbps
USB
USB 2.0

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XR21B1411IL16TR-F 产品概述

一、产品概述

XR21B1411IL16TR-F 是 MAXLINEAR(迈凌)推出的一款高集成度 USB 转 UART 桥接芯片,面向工业级与嵌入式通信应用。器件支持 USB 2.0 全速(12 Mbps)传输,工作电压范围为 4.4V 至 5.25V,工作温度范围为 -40°C 至 +85°C。芯片集成了大容量 UART FIFO(TX/RX 分别为 128 / 384 字节),能够显著减少 MCU 与主机之间的数据丢包和中断开销,适合需要高吞吐和稳定性的串口通信场景。

二、主要技术参数

  • 品牌:MAXLINEAR(迈凌)
  • 型号:XR21B1411IL16TR-F
  • USB 协议:USB 2.0(全速,12 Mbps)
  • UART FIFO:TX 128 字节 / RX 384 字节
  • 工作电压:4.4 V ~ 5.25 V
  • 工作温度:-40°C ~ +85°C(工业级)
  • 封装:QFN-16-EP(3 mm x 3 mm)
  • 功能:USB ↔ UART 双向数据收发、外围硬件流控支持、低功耗模式

三、关键特性与优势

  • 大容量 FIFO:TX/RX FIFO 的不对称设计(128/384 字节)可降低 MCU 轮询/中断负担,提高数据稳定性,尤其在突发数据或高带宽短时传输时优势明显。
  • USB 2.0 全速支持:12 Mbps 带宽能满足大多数串口仿真与外设通信需求,同时兼容主流 USB 主机。
  • 工业级温度范围:-40°C 至 +85°C,适用于工业控制、现场设备与恶劣环境下长期可靠工作。
  • 小尺寸封装:QFN-16-EP 3x3mm 提供高密度 PCB 布局能力,便于在空间受限的模块或终端中集成。
  • 功耗与兼容性:支持低功耗模式,通常可与主流操作系统的通用串口驱动(虚拟 COM)配合使用,便于开发与部署。

四、典型应用场景

  • 工业控制与自动化终端:PLC、工业网关、数据采集模块等需要稳定串口通信的设备。
  • 嵌入式设备调试与固件下载:为 MCU、FPGA 提供可靠的调试串口桥接。
  • 医疗设备与测试测量:对数据完整性与抗干扰有较高要求的便携与台式设备。
  • POS、刷卡与智能终端:需将传统串口外设接入 USB 主机的终端设备。

五、设计与布局建议

  • USB 差分线对(D+/D-)应做受控阻抗布线,并尽量短且等长,避免过多弯折与交叉噪声源。
  • 在 USB 线上增加合适的串联阻容网络及 ESD 防护(TVS)以提高抗静电与浪涌能力。
  • 电源端建议在芯片 VCC 附近放置 0.1 µF 陶瓷旁路电容,并加入 1 µF~10 µF 的去耦,提高电源稳定性。
  • QFN 暴露金属垫(EP)必须焊接至 PCB 接地平面并通过热过孔铺铜以利散热与电气性能。
  • 若使用硬件流控(RTS/CTS),需处理好电平匹配与线长,必要时增加缓冲或电平转换电路。

六、封装与可靠性

XR21B1411IL16TR-F 采用紧凑 QFN-16-EP(3×3 mm)封装,适合高密度板级设计。封装的暴露底垫便于热流散与接地。器件按工业级温度范围设计,符合长期现场运行的稳定性要求。建议遵循制造商的回流焊温度曲线与湿敏等级(MSL)处理规范,确保焊接可靠性与储存品质。

七、驱动与软件支持

该系列芯片通常提供虚拟 COM 端口驱动以及参考固件支持,可方便地在 Windows、Linux、macOS 等主流操作系统下实现串口透明传输。实际产品选型时,请参考厂商的最新数据手册与驱动包,确认具体的 API、配置寄存器与中断行为,以便进行固件适配与性能调优。

总结:XR21B1411IL16TR-F 是一款面向工业与嵌入式场景的高可靠性 USB-to-UART 方案,凭借大容量 FIFO、USB 2.0 全速接口与工业级工作温度,适用于对数据完整性与系统稳定性有较高要求的产品设计。对于最终定稿与生产验证,请参考 MAXLINEAR 官方数据手册与应用笔记以获取详细电气特性和引脚图。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.