Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
XR21B1411IL16TR-F 是 MAXLINEAR(迈凌)推出的一款高集成度 USB 转 UART 桥接芯片,面向工业级与嵌入式通信应用。器件支持 USB 2.0 全速(12 Mbps)传输,工作电压范围为 4.4V 至 5.25V,工作温度范围为 -40°C 至 +85°C。芯片集成了大容量 UART FIFO(TX/RX 分别为 128 / 384 字节),能够显著减少 MCU 与主机之间的数据丢包和中断开销,适合需要高吞吐和稳定性的串口通信场景。
XR21B1411IL16TR-F 采用紧凑 QFN-16-EP(3×3 mm)封装,适合高密度板级设计。封装的暴露底垫便于热流散与接地。器件按工业级温度范围设计,符合长期现场运行的稳定性要求。建议遵循制造商的回流焊温度曲线与湿敏等级(MSL)处理规范,确保焊接可靠性与储存品质。
该系列芯片通常提供虚拟 COM 端口驱动以及参考固件支持,可方便地在 Windows、Linux、macOS 等主流操作系统下实现串口透明传输。实际产品选型时,请参考厂商的最新数据手册与驱动包,确认具体的 API、配置寄存器与中断行为,以便进行固件适配与性能调优。
总结:XR21B1411IL16TR-F 是一款面向工业与嵌入式场景的高可靠性 USB-to-UART 方案,凭借大容量 FIFO、USB 2.0 全速接口与工业级工作温度,适用于对数据完整性与系统稳定性有较高要求的产品设计。对于最终定稿与生产验证,请参考 MAXLINEAR 官方数据手册与应用笔记以获取详细电气特性和引脚图。
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Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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