WMSIC Electronic Components

MAXLINEAR SP6669AEK-L/TRR3 SP6669AEK

ModelSP6669AEK-L/TRR3
PackageSOT-23-5
BrandMAXLINEAR
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 23+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
MAXLINEAR SP6669AEK-L / TRR3
Type
MAXLINEAR
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MAXLINEAR
Electronic Component
SP6669AEK-L/TRR3
Electronic Component
1
Package
SOT-23-5
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.039g
Electronic Component
1
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0000515019
Operating Temperature
40℃~+85℃
Operating Voltage
2.5V~6V
Switching Frequency
1.5MHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SP6669AEK-L/TRR3 产品概述

一、产品简介

SP6669AEK-L/TRR3 是迈凌(MAXLINEAR)系列的一款降压型开关稳压器,采用 SOT-23-5 小封装,适合对空间和功耗有严格要求的便携与嵌入式系统。器件工作电压范围宽(2.5V–6V),输出可调并集成同步整流开关,能在高开关频率下实现较小的外部元件尺寸和较高的转换效率。

二、主要规格

  • 功能类型:降压(Buck)型可调输出
  • 输入电压:2.5V ~ 6V
  • 最大输出电流:800mA
  • 开关频率:1.5MHz
  • 静态电流(Iq):18µA(典型,空载低功耗表现优良)
  • 同步整流:是(内部同步开关)
  • 开关管:内部集成
  • 输出通道数:1 路
  • 工作温度:-40℃ ~ +85℃
  • 封装:SOT-23-5

三、关键特点

  • 高集成度:内部开关管与同步整流设计,减少外部 MOSFET 和驱动器件,简化 PCB 布局。
  • 高频率工作:1.5MHz 开关频率便于使用小体积电感与陶瓷电容,适合空间受限应用。
  • 低静态电流:18µA 的待机电流有利于延长电池供电系统的待机时间。
  • 宽输入范围与可调输出:支持多种电池与供电总线,输出电压通过外部电阻分压设置,灵活性高。

四、典型应用

  • 移动设备与便携终端(蓝牙设备、手持仪器)
  • 电池供电的物联网节点与传感器模块
  • 工业控制与嵌入式电源管理
  • 点亮小功率显示器、MCU 供电轨

五、设计要点与注意事项

  • 外围元件:建议采用低 ESR 陶瓷电容以获得稳定的瞬态响应;电感需兼顾电流承受能力与饱和特性,选型时注意峰值电流裕量。
  • 布局:高频开关器件及环路走线应尽量短且紧凑,输入电容应靠近器件 VIN 引脚放置以减小 EMI。
  • 热管理:尽管封装小巧,但在 800mA 输出下器件功耗会产生热量,需预留热流散路径并考虑铜面面积以帮助散热。
  • 启动与保护:如系统需软启动、过流或过热保护,请参考系统级策略并在外部电路中配置必要的保护措施。

六、封装与可靠性

SOT-23-5 小封装利于节省 PCB 面积,适合批量制造与表面贴装工艺;器件工作温度覆盖工业级范围(-40℃ 到 +85℃),适应多种应用场景。对于高可靠性需求,应在参考设计基础上进行热循环与应力验证。

七、总结

SP6669AEK-L/TRR3 在小封装下提供高开关频率、内部同步整流与低静态电流的组合,适合对体积、效率与电池寿命有要求的单路降压电源设计。建议在设计初期结合目标负载和热预算评估器件效率与散热方案,以保证长期稳定运行。若需具体参考电路或器件脚位信息,可查阅厂商完整数据手册以获得准确的原理图与布局建议。

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