WMSIC Electronic Components

MAXLINEAR SP202ECT-L/TR SP202ECT

ModelSP202ECT-L/TR
PackageSOIC-16-300mil
BrandMAXLINEAR
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 21+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
MAXLINEAR SP202ECT-L / TR
Type
MAXLINEAR
Unit
Electronic Component
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MAXLINEAR
Electronic Component
SP202ECT-L/TR
Electronic Component
1
Package
SOIC-16-300mil
Type
Transceiver
Electronic Component
RS232IC
Electronic Component
0.76g
Electronic Component
1
Features
Electronic Component
Electronic Component
BM0265874040
Operating Temperature
0℃~+70℃
Operating Voltage
4.5V~5.5V
Receiver
2
Data
240Kbps

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SP202ECT-L/TR 收发器产品概述

一、产品基本定位与核心身份

SP202ECT-L/TR是MAXLINEAR(迈凌) 推出的一款全双工串行收发器,采用「2驱动器+2接收器」(2/2)架构,搭载16引脚小外形集成电路(SOIC)封装。该器件聚焦低速到中速双向串行通信场景,是传统RS-232接口方案的高效集成选项,具备电路简化、抗干扰性强等核心特点,适用于商用及轻工业电子系统。

二、核心性能参数详解

该器件的关键参数直接支撑其应用场景,具体如下:

  • 通信架构:全双工设计,内置2个独立驱动器和2个接收器,支持同时双向数据传输,无需分时切换通道;
  • 传输速率:最高支持240Kbps 稳定传输,满足低速串行通信(如传感器数据、控制指令)的速率需求;
  • 电源特性:工作电压范围为4.5V~5.5V,兼容常见5V电源系统(如单片机、嵌入式主板的稳压输出);
  • 静电防护:具备**±15kV** 高静电放电(ESD)保护能力,符合IEC 61000-4-2等标准,降低生产、测试及现场使用中的器件损坏风险;
  • 集成特性:内置电荷泵电路,无需外接额外电容即可实现电平转换(适配RS-232协议的电平需求),大幅简化外围电路;
  • 温度范围:商用级工作温度0℃~+70℃,覆盖大部分室内环境及轻工业应用场景(如办公设备、小型工业仪表)。

三、关键技术优势

相较于传统分立或低集成收发器,SP202ECT-L/TR的核心优势体现在:

  1. 集成度高:内置电荷泵+2/2收发器,减少外围元件数量(无需外接电容),缩小电路板面积,降低系统BOM成本;
  2. 抗干扰性强:±15kV ESD保护可有效抵御人体接触、设备插拔、静电放电等场景的冲击,提升系统长期可靠性;
  3. 电压兼容性好:4.5V~5.5V宽电压范围,适配不同精度的5V电源(如1%稳压源、电池降压输出),无需额外电压转换;
  4. 全双工效率:2个独立通道支持同时收发,避免分时通信的延迟,适合需要双向实时数据交互的场景(如传感器+控制器的双向指令传输);
  5. 封装适配性:16-SOIC封装体积小巧(约7.5mm×5.3mm),兼容自动化贴装工艺,适合小型化电子设备(如POS终端、小型PLC)的设计需求。

四、典型应用场景

该器件因性能均衡、设计简单,广泛应用于以下领域:

  1. 工业控制:小型PLC的串行通信接口、传感器数据采集终端(如温度/压力传感器的RS-232输出模块)、小型工业仪表的通信单元;
  2. 商用电子:POS收银机的外接设备接口(小票打印机、扫码枪的串行连接)、自动售货机的后台通信模块、办公打印机的串行管理接口;
  3. 通信设备:小型路由器/交换机的串行管理接口、调制解调器的收发单元、嵌入式网关的低速串行扩展接口;
  4. 嵌入式系统:单片机开发板的RS-232扩展接口、车载电子的辅助通信模块(如OBD诊断系统的低速接口)、智能家居设备的串口通信单元。

五、选型与使用注意事项

  1. 选型匹配:需确认系统通信速率≤240Kbps、电源电压在4.5V5.5V范围内、环境温度处于0℃+70℃区间;
  2. 外围电路:因内置电荷泵,无需外接电容(部分场景可增加100nF滤波电容优化电源噪声),电路设计简洁;
  3. 防护升级:虽器件自带±15kV ESD,但建议在接口端增加TVS管,进一步提升现场抗静电能力;
  4. 焊接要求:16-SOIC封装需采用回流焊或热风枪焊接,避免手工焊接时温度过高(建议≤260℃)损坏器件。

该器件以「高集成、低成本、抗干扰」为核心竞争力,是商用及轻工业串行通信场景的可靠选择。

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