WMSIC Electronic Components

MAXLINEAR XR76208ELTR-F XR76208ELTR

ModelXR76208ELTR-F
PackageQFN-30(5x5)
BrandMAXLINEAR
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
MAXLINEAR XR76208ELTR-F
Type
QFN-30(5X5)
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MAXLINEAR
Electronic Component
XR76208ELTR-F
Electronic Component
1
Package
QFN-30(5x5)
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.257g
Electronic Component
1
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0265874045
Operating Temperature
40℃~+125℃
Operating Voltage
5V~40V
Switching Frequency
100kHz~800kHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XR76208ELTR-F 同步降压型电源管理IC产品概述

XR76208ELTR-F是迈凌(MAXLINEAR)推出的高电流同步降压DC-DC电源管理IC,专为需要宽输入范围、大输出电流、高效率且紧凑设计的电力电子场景打造。以下从核心参数、集成特性、应用场景等维度展开详细概述。

一、核心参数与性能边界

XR76208ELTR-F的参数覆盖了工业级电源设计的核心需求,关键性能边界清晰:

  • 输入电压范围:5V~40V,覆盖12V/24V工业电源、24V车载系统、40V高压直流等常见输入场景,无需额外升压/降压预处理,简化系统架构;
  • 输出电压:600mV可调,最低输出600mV满足低功耗MCU、FPGA等核心器件的低电压供电需求,通过外部电阻分压可灵活调整至目标电压(如3.3V、5V);
  • 输出电流能力:8A连续输出,支持中等功率负载(如高性能处理器、存储模块),无需并联多颗IC即可满足大电流需求,降低BOM成本与PCB复杂度;
  • 开关频率:100kHz~800kHz宽范围可调,可根据EMI要求、电感尺寸优化频率:低频(100kHz)适配大电感,效率更高;高频(800kHz)缩小电感/电容体积,适合高密度设计;
  • 工作温度范围:-40℃~+125℃工业级宽温,满足户外、车载、工业现场等极端温度环境的可靠性要求,符合IEC 60068等环境标准。

二、集成特性与拓扑优势

XR76208ELTR-F采用同步降压拓扑,集成多项关键特性提升系统效率与设计灵活性:

  • 同步整流设计:内置高低侧N沟道MOSFET(开关管),替代异步整流的续流二极管,显著降低导通损耗与反向恢复损耗,典型负载下转换效率可达90%以上,减少散热片需求;
  • 内置功率开关管:无需外置MOSFET,简化电路设计,缩小PCB面积,同时避免外置器件的匹配问题(如栅极驱动、热匹配),提升系统稳定性;
  • 输出可调机制:通过反馈引脚(FB)外接分压电阻,可精准设置输出电压(600mV~输出上限),适配不同负载的电压需求,无需更换IC即可应对多场景应用。

三、封装与环境适应性

XR76208ELTR-F的封装与可靠性设计适配高密度、 harsh环境需求:

  • 封装形式:30-QFN(5×5mm)小封装,引脚间距0.5mm,适合服务器主板、便携式设备等高密度PCB布局;QFN封装热阻低(典型值~15℃/W),可有效散发热量,无需额外散热措施;
  • 电磁兼容(EMC)优化:可调开关频率可规避特定频点干扰(如AM广播、开关电源噪声),配合内置软启动功能,降低上电浪涌电流,满足IEC/EN 55032等EMC标准。

四、典型应用场景

XR76208ELTR-F的参数特性使其成为多领域低电压大电流供电的优选方案:

  1. 工业控制设备:PLC、工业机器人、传感器节点的12V/24V转3.3V/5V供电;
  2. 通信基础设施:基站RRU、光纤收发器、路由器的核心芯片(如FPGA、DSP)供电;
  3. 数据中心/服务器:CPU、内存、SSD等低电压大电流负载的分布式供电;
  4. 车载电子:车载信息娱乐系统、ADAS控制器的24V转5V/3.3V供电(符合-40℃~+125℃宽温要求);
  5. 消费电子:高性能游戏本、工作站的GPU/CPU供电(小封装适配紧凑机身)。

五、总结

XR76208ELTR-F凭借宽输入范围、高输出电流、同步整流高效率、小封装等核心优势,兼顾性能与设计灵活性,是工业、通信、数据中心等领域低电压大电流供电的可靠选择,可有效简化系统设计、降低成本并提升可靠性。

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