Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
MAXLINEAR SP483EEN-L/TR SP483EEN
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- MAXLINEAR SP483EEN-L / TR
- Type
- MAXLINEAR
- Unit
- Electronic Component
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MAXLINEAR
- Electronic Component
- SP483EEN-L/TR
- Electronic Component
- 1
- Package
- SOP-8
- Type
- Transceiver
- Electronic Component
- RS-485 / RS-422IC
- Electronic Component
- 0.243g
- Electronic Component
- 1
- Features
- Tx / Rx;; Low Power
- Electronic Component
- BM0226318453
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 4.75V~5.25V
- Receiver
- 1
- Data
- 250Kbps
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SP483EEN-L/TR 产品概述
一、产品简介
SP483EEN-L/TR 是 MAXLINEAR（迈凌）推出的一款高可靠性半双工收发器，封装为 SOP-8。器件集成 1 个差分驱动器和 1 个差分接收器，工作电压范围为 4.75V 至 5.25V，工作温度覆盖工业级 -40℃ 到 +85℃。典型数据速率为 250 kbps，静态电流约 900 μA，具备 ±15 kV 的静电放电（ESD）保护能力，适用于需要稳健差分通信的各类工业与嵌入式系统。
二、主要特性
- 半双工差分收发结构：1 个驱动器 / 1 个接收器，支持单总线双向通信。
- 工作电压：4.75V ~ 5.25V，兼容典型 5V 系统供电。
- 数据速率：250 kbps，满足中速通信需求。
- 低功耗待机：静态电流约 900 μA，利于功耗受限的场合。
- 工业级温度范围：-40℃ ~ +85℃，适应恶劣环境。
- 强抗静电能力：±15 kV ESD（人体模型），提高系统可靠性。
- 封装：SOP-8，便于通用 PCB 布局与批量生产。
三、典型应用
- 工业控制通信总线与远程 I/O。
- 楼宇自动化、门禁与楼宇照明控制。
- 电机控制器与传感器网络数据链路。
- 嵌入式系统中的差分串行链路与现场设备互联。
四、设计与使用建议
- 在 VCC 与 GND 之间放置 0.1 μF 陶瓷旁路电容，靠近器件电源脚焊盘以抑制高频噪声。
- 差分总线两端建议使用终端电阻（例如 120 Ω）以降低反射，并在需要时采用偏置电阻实现故障安全总线（idle biasing）。
- 对于更高抗扰度，建议在差分线前端增加共模电感或共模滤波器，并在易受静电冲击的位置外加 TVS 二极管。
- 布线时保持差分线对等长、紧耦合，避免穿越敏感模拟区或高频开关器件。
- 注意总线节点上的最大负载能力与收发器数目，保证总线驱动裕量。
五、封装与采购信息
- 型号：SP483EEN-L/TR
- 品牌：MAXLINEAR（迈凌）
- 封装：SOP-8（工业通用封装，便于自动贴装与回流焊工艺）
本产品以其工业级温度、低功耗及良好的静电防护性能，适合在要求稳定通信与长期可靠性的重要系统中使用。选型时请结合系统总线拓扑、终端匹配与 EMC 要求进行验证，必要时参考厂商完整数据手册以获得引脚定义、时序和更多电气参数。
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