WMSIC Electronic Components

MAXLINEAR SP3232ECY-L/TR SP3232ECY

ModelSP3232ECY-L/TR
PackageTSSOP-16
BrandMAXLINEAR
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
MAXLINEAR SP3232ECY-L / TR
Type
MAXLINEAR
Unit
Electronic Component
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MAXLINEAR
Electronic Component
SP3232ECY-L/TR
Electronic Component
1
Package
TSSOP-16
Type
Transceiver
Electronic Component
RS232IC
Electronic Component
0.149g
Electronic Component
1
Electronic Component
BM0226547209
Operating Temperature
0℃~+70℃
Operating Voltage
3V~5.5V
Receiver
2
Data
235Kbps
Static Current
1mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SP3232ECY-L/TR 产品概述

一、产品简介

SP3232ECY-L/TR 是迈凌(MAXLINEAR)推出的一款双通道 RS-232 收发器(2 驱动 / 2 接收),封装为 TSSOP-16,适用于 0℃~+70℃ 工业/商用温度范围。器件内置电荷泵,可在单电源环境下生成 RS-232 所需的高负压和高正压电平,工作电压范围宽(3.0V~5.5V),便于与 3.3V 和 5V 系统直接配合使用。

二、主要参数亮点

  • 类型:收发器(Transceiver),2 路驱动器 / 2 路接收器(FULL 2/2)
  • 工作电压:3.0V ~ 5.5V,兼容主流 MCU/FPGA 电源
  • 数据速率:235 kbps,满足常见串口通信需求
  • 静态电流:约 1 mA(低功耗,有利于电池应用)
  • 电荷泵:内置,简化外部电源需求
  • 静电保护:高达 ±15 kV(人体模型,提升系统可靠性)
  • 工作温度:0℃ ~ +70℃
  • 封装:TSSOP-16
  • 品牌:MAXLINEAR(迈凌)

三、功能与特点

  • 单电源 RS-232 通信:内置电荷泵生成所需电平,免去双电源设计复杂度。
  • 低功耗待机:典型静态电流约 1 mA,适合便携和电池供电设备。
  • 可靠的 ESD 保护:±15 kV 静电防护,增强现场抗扰能力,降低接口故障率。
  • 兼容性强:3.0V~5.5V 宽电源范围可直接与 3.3V/5V 逻辑接口连接,无需电平转换。
  • 紧凑封装:TSSOP-16 适合空间受限的 PCB 布局。

四、典型应用场景

  • 串口设备:调制解调器、POS 终端、打印机等 RS-232 外围通信接口
  • 嵌入式系统:单片机与 PC 或外设之间的 RS-232 串口转换
  • 工业控制:低速串行总线、设备通信
  • 电池供电或低功耗终端:由于低静态电流特性,适用于移动终端与远程节点

五、使用建议与 PCB 布局要点

  • 电荷泵电容:内部带电荷泵的器件通常配合外部飞行电容(常见为 4 × 0.1 µF),请按器件手册推荐值和连线方式选取与布置。
  • 电源去耦:靠近 VCC 引脚放置 0.1 µF 陶瓷去耦电容以抑制瞬态噪声,并尽量缩短回流路径。
  • 接地处理:在高噪声环境中,建议将 GND 做平面处理并保证信号回路完整,避免长导线跨接。
  • ESD 与接口保护:尽管器件本身具备 ±15 kV 抗静电能力,外部使用场合仍建议在连接器处采用浪涌抑制器或电视抑制器以进一步提升系统可靠性。
  • 温度与散热:在额定温度范围内正常工作,TSSOP-16 封装需注意 PCB 热阻与布局,如长时间高负载建议评估热耗散。

六、封装与采购提示

  • 型号:SP3232ECY-L/TR,封装为 TSSOP-16,适合量产贴片工艺。
  • 选型时请核对供应商资料与最新数据手册,确认外部电容值、引脚排列及典型参数,以保证设计一次性通过。

如需器件引脚定义、典型应用电路或与特定 MCU 的接口示例,我可以基于器件手册提供详细接线图与布局建议。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.