WMSIC Electronic Components

Mingda Micro MD52E33WB6

ModelMD52E33WB6
PackageXDFN-4-EP(1x1)
BrandElectronic Component
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MD52E33WB6
Type
Mingda Micro
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
230mV@(500mA)
Electronic Component
Electronic Component
Electronic Component
MD52E33WB6
Electronic Component
1
Package
XDFN-4-EP(1x1)
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.016g
Electronic Component
1
Features
Output
Electronic Component
BM0264548235
Operating Temperature
40℃~+85℃
Operating Voltage
7V
Output
Electronic Component
Output Voltage
3.3V
Output Current
500mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MD52E33WB6 产品概述

一、产品简介

MD52E33WB6 是明达微推出的一款高性能固定输出线性稳压器(LDO),输出电压为 3.3V,面向对低噪声、低功耗和高可靠性有严格要求的便携及工业应用。器件采用紧凑的 XDFN-4-EP (1×1 mm) 封装,单通道输出,支持使能控制与输出放电,集成多重保护功能。

二、主要规格

  • 输入电压范围(最大工作电压):7V(典型工作以不超过 7V 为宜)
  • 输出电压:3.3V(固定)
  • 最大输出电流:500 mA
  • 压差(Dropout):230 mV @ 500 mA
  • 静态电流(Iq):600 nA(非常适合电池供电与待机应用)
  • PSRR:34 dB @ 1 kHz
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 输出通道数:1

三、核心功能特性

  • 输出放电:在禁能(EN=Low)时主动将输出放电,避免负载侧电压滞留。
  • 使能控制(EN):外部逻辑控制开启/关闭,支持系统电源管理。
  • 过流保护(OCP)与短路保护:限制异常电流,提升系统可靠性。
  • 热关断(Thermal Shutdown):温度异常时自动关断并在降温后恢复。
  • 低静态电流:超低待机电流适合长时间待机或低功耗场景。
  • 稳定性友好:对常见陶瓷输出电容兼容,易于工程实现(具体电容值和 ESR 依数据手册调整)。

四、典型应用场景

  • 电池供电设备(便携式仪器、手持终端、可穿戴设备)
  • 工业控制与传感器节点(需要稳压与过载保护)
  • 通信与无线模块电源前端(3.3V 数字/模拟供电)
  • IoT 节点、低功耗 MCU 驱动电源

五、封装与热性能

MD52E33WB6 的 XDFN-4-EP (1×1 mm) 封装尺寸小,适合空间受限设计。底部散热焊盘(EP)应可靠焊接到 PCB 的接地平面以提升导热。由于 500 mA 输出会产生一定功耗,设计时需评估环境温升与 PCB 热阻,必要时采用散热铜厚、过孔与大面积接地层来改善散热性能。

六、设计与布板建议

  • 输入/输出去耦:建议在 VIN 及 VOUT 近端分别放置 1 μF ~ 10 μF 的低 ESR 陶瓷电容,靠近器件引脚布置以保证稳定与抑制纹波。
  • 接地与散热:EP 焊盘应与大面积地平面相连,必要时增加热通孔(vias)直到内部接地层以改善散热。
  • 路径最短:VIN、VOUT 与 GND 的走线应尽量短且宽,避免串扰与阻抗上升。
  • 使能控制:EN 引脚可直接与 MCU 或上级电源控制信号相连,低电平禁能时输出会被快速放电至接近 0V。
  • 保护与调试:在初次调试时建议限流电源上电,并验证在不同负载、短路与高温条件下器件保护动作是否符合系统预期。

MD52E33WB6 以其低静态电流、低压差与完整的保护机制,适合对功耗与可靠性有严格要求的中小功率电源设计场合。欲获得详细的电气特性曲线、典型应用电路与布局范例,请参考明达微官方数据手册。

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