WMSIC Electronic Components

Milliohm HOT(0.4*1.5)-5.2-0R-I HOT

ModelHOT(0.4*1.5)-5.2-0R-I
PackageSMD,1.5x5.2mm
BrandMilliohm
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

17 specifications

Core information

Product name
Milliohm HOT(0.4*1.5)-5.2-0R-I
Type
MILLIOHM
Minimum package
12000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MILLIOHM
Electronic Component
HOT(0.4*1.5)-5.2-0R-I
Electronic Component
1
Package
SMD,1.5x5.2mm
Electronic Component
Current Sense Resistor / Shunt
Electronic Component
0.059g
Electronic Component
0Ω
Electronic Component
1
Electronic Component
BM0264487179
Electronic Component
SMD
Current
10A
Electronic Component
Electronic Component
Electronic Component
12000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HOT(0.4*1.5)-5.2-0R-I 产品概述

一、产品简介

HOT(0.4*1.5)-5.2-0R-I 为 Milliohm(毫欧)品牌的一款贴片式电流采样/分流零欧电阻(0Ω SMD)。封装尺寸为 1.5 × 5.2 mm,设计用于电源、功率模块与信号跳线中的低阻抗连接与电流取样方案。其阻值标称为 0Ω(毫欧级),额定电流 10A,适合在有限空间内实现高电流导通或作为可配置跳线使用。

二、主要参数与特性

  • 阻值:0Ω(毫欧级,作为低阻抗跳线或取样点使用)
  • 额定电流:10A(连续负载能力,与 PCB 散热、焊盘面积相关)
  • 封装:SMD,尺寸 1.5×5.2 mm,适配表面贴装工艺
  • 主要功能:低阻抗连接、可替换跳线、短路/分流路径、测试开路点方便替换
  • 工艺兼容:适用于常规无铅回流焊流程,便于大批量贴装与回流焊接

三、典型应用场景

  • 电源管理:主电源轨短接、可配置的输入/输出路径
  • 电机驱动与功率模块:作为高电流导通引线或测试点
  • PCB 调试与版本管理:以 0Ω 电阻作为选项跳线替换功能元件
  • 电流采样预留位:在开发阶段作为占位件,量产时更换为精密分流电阻以实现精确测量

四、安装与 PCB 布局建议

  • 焊盘设计:为保证 10A 级别的热与电流承载,建议扩展焊盘铜面积并增加过孔或散热铜箔以降低接触电阻与温升。
  • 布局位置:尽量靠近电流路径关键点,减少走线长度与不必要的阻抗。
  • 热管理:高电流环境下应考虑对流/传导散热,必要时在焊盘背面增加填铜或热孔。
  • 回流工艺:采用标准 SMD 无铅回流曲线,避免在波峰焊或过高温度下造成件体应力。

五、选型与注意事项

  • 功能区分:若用于精确电流检测,0Ω 元件仅作为占位或旁路,实际测量应选用标定的毫欧级分流电阻并采用 Kelvin 测量结构。
  • 额定电流相关:10A 为元件自身在理想散热条件下的额定值,实际允许电流受 PCB 散热和环境温度影响,应按系统热仿真或实测数据确认。
  • 可替换性:在产品版本管理或调试阶段,使用 0Ω 便于快速切换回路;量产时如需长时间高精度采样,建议更换为指定阻值与 TCR 的分流器。

六、测试与可靠性

  • 测试方法:常用直流低电阻表或四端法进行接触电阻/通断测试;高电流测试需结合温升、接触电阻与长期老化评估。
  • 可靠性:在符合焊接工艺和合理散热设计下,SMD 封装可提供稳定的机械与电气性能;存储与贴装过程中应避免过度机械力与潮湿环境。
  • 合规性:该类元件一般满足工业常规环保与可回收要求,具体合规证书可向供应商索取确认文件。

以上为 HOT(0.4*1.5)-5.2-0R-I 的产品概述与工程应用建议。根据具体应用场景,可进一步提供 PCB 焊盘图、热仿真建议或替代分流器选型支持。

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