WMSIC Electronic Components

Nexperia BC817,215 BC817

ModelBC817,215
PackageSOT-23
BrandNexperia
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
Nexperia BC817, 215
Type
NEXPERIA
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
NEXPERIA
Electronic Component
BC817,215
Electronic Component
1
Package
SOT-23
Electronic Component
1 NPN
Electronic Component
Transistor(BJT)
Electronic Component
0.024g
Electronic Component
1
Electronic Component
BM0000281728
Operating Temperature
65℃~+150℃
Transistor Type
NPN
Frequency(f T)
100MHz
Power Dissipation(Pd)
250mW
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BC817,215 产品概述

产品简要信息

BC817,215 是一种高性能 NPN 型三极管,广泛应用于各种电子电路中,尤其是在信号放大和开关应用中。该器件由 Nexperia(安世半导体)制造,具有优良的电气特性和稳定的工作性能。其工作频率高达 100MHz,适合用于高速开关和放大电路。

基本参数及性能

  • 额定功率:250mW
  • 集电极电流 (Ic):最大 500mA
  • 集射极击穿电压 (Vce):最大 45V
  • 饱和压降 (Vce(sat)):在不同集电极电流 (Ic) 下的饱和压降最大值为 700mV(在 50mA 和 500mA 负载时)
  • 截止电流 (ICBO):最大 100nA
  • DC 电流增益 (hFE):在 100mA @ 1V 时最小值为 100
  • 工作温度范围:可承受最高 150°C 的结温
  • 频率——跃迁频率:高达 100MHz
  • 安装类型:表面贴装型(SMD)
  • 封装类型:SOT-23-3

封装与安装

BC817,215 采用 SOT-23 封装,这是一种非常小型的表面贴装封装,适合现代电子产品的紧凑设计。SOT-23 封装不仅节省了空间,而且有助于增强散热性能,确保器件在高温环境下的可靠工作。

主要应用

BC817,215 可广泛用于电源管理、开关电路、线性放大器及高频应用,其高频特性使其在 RF 应用中也表现出色。以下是一些典型应用场景:

  • 开关电路:适用于驱动小功率负载,如继电器、LED 等。
  • 信号放大器:在音频信号和射频信号处理中,可用于增益提升。
  • 电流控制电路:在各种控制电路中,以低电平驱动高电平负载,提供高效的电流控制。
  • 音频和视频设备:广泛使用于电视、音响设备及其他音频/视频处理电路中。

性能优势

  1. 高集电极电流:最大支持 500mA 的集电极电流,适合多种负载驱动要求。
  2. 低饱和压降:饱和压降仅为 700mV,大幅减少了功耗,提升了整体电路效率。
  3. 高 DC 增益:DC 电流增益高达 100,确保信号放大的有效性和准确性。
  4. 良好的热稳定性:在高达 150°C 的工作环境中依然保持稳定性能。
  5. 小巧轻便的封装:SOT-23 封装降低了对电路板空间的占用,便于高密度设计。

结论

综上所述,BC817,215 NPN 三极管凭借其合理的性能参数和广泛的应用范围,成为现代电子设计中的一种重要元器件。其高集电极电流、低饱和压降及卓越的频率响应特性,使其在多种电子应用中扮演关键角色,帮助工程师和设计师解决实际问题,提高产品性能和可靠性。

选择 BC817,215,可以确保您的电子产品在各种工况下的高效率与稳定性,是电子设计中不可或缺的重要组成部分。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.