WMSIC Electronic Components

Nexperia 2N7002NXAKR

Model2N7002NXAKR
PackageSOT-23
BrandNexperia
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Nexperia 2N7002NXAKR
Type
NEXPERIA
Minimum package
3000 卷

Technical parameters

Electronic Component
NEXPERIA
Electronic Component
2N7002NXAKR
Electronic Component
1
Package
SOT-23
Electronic Component
1 N
Electronic Component
MOSFET
Electronic Component
0.025g
Electronic Component
1
Electronic Component
BM0094299461
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
265mW;1.33W
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
60V
Capacitor(Ciss)
20pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

2N7002NXAKR 产品概述

1. 产品简介

2N7002NXAKR 是一款高性能的 N 沟道 MOSFET(场效应管),由 Nexperia USA Inc. 制造。该器件广泛应用于各种电子电路中,尤其是在低功耗、高效率的开关和驱动应用场景下。其优良的特性使得它成为实现高性能电路设计的理想选择。

2. 基本参数

2N7002NXAKR 的主要规格包括:

  • 器件状态:有源
  • FET 类型:N 沟道
  • 技术:MOSFET(金属氧化物)
  • 最大漏源电压(Vdss):60V
  • 25°C 时电流 - 连续漏极 (Id):190mA(Ta),300mA(Tc)
  • 驱动电压:5V,10V(对应最大和最小 Rds On)
  • 工作温度范围:-55°C ~ 150°C(TJ)
  • 功率耗散:265mW(Ta),1.33W(Tc)
  • 栅极电压阈值(Vgs(th)):最大 2.1V @ 250µA
  • 不同 Id、Vgs 时导通电阻(Rds(on)):最大 4.5Ω @ 100mA,10V
  • 输入电容 (Ciss):最大 20pF @ 10V
  • 栅极电荷 (Qg):最大 430pC @ 4.5V

3. 封装和安装

2N7002NXAKR 采用表面贴装型(SMD)封装,具体为高密度的 SOT-23-3 封装形式。该封装使得器件的安装更加方便,适用于现代高集成度的电路设计。在 SOT-23 封装中,器件稳定性强、散热性能好,能够有效保证产品在高工作频率和高温度条件下的可靠性。

4. 应用场景

2N7002NXAKR 的设计使其非常适合以下应用场景:

  • 开关电源:可以作为开关元件使用,实现高效的电能转换。
  • LED 驱动:常用于 LED 照明电路中的驱动,具有低导通损耗。
  • 信号开关:在低功耗信号开关应用中,由于其小的门电荷和低栅电压阈值,能够快速响应。
  • 电机驱动:在小功率直流电机的驱动电路中,用作驱动开关,确保高效运行。
  • 便携电子产品:由于其低功耗特性,适用于便携式电子设备,以延长电池使用寿命。

5. 性能优势

2N7002NXAKR 的优点在于其高效能的工作性能,尤其是在导通电阻(Rds(on))和较高的漏源电压(Vdss)。其最大 Rds(on) 仅为 4.5Ω,确保器件在导通状态下的功率损耗极小,适合高频率的开关操作。此外,器件的门电荷(Qg)较小,使其在开关状态切换时耗能更少,提升整体效率。

其宽广的工作温度范围为产品在恶劣环境下的应用提供了保障,能够适应更极端的工作条件,满足不同客户的设计需求。

6. 总结

总体来看,2N7002NXAKR 是一款功能强大,性能卓越的 N 沟道 MOSFET,凭借其优良的电气特性和多样的应用场景,成为现代电子设计中不可或缺的元器件之一。 idéale选择将有效提高电子产品的性能和可靠性,满足市场对高效能、低功耗解决方案日益增长的需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.