Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Nexperia PESD24VF1BLYL
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Nexperia PESD24VF1BLYL
- Type
- NEXPERIA
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- NEXPERIA
- Electronic Component
- PESD24VF1BLYL
- Electronic Component
- 1
- Package
- DFN1006-2
- Electronic Component
- Electronic Component
- Type
- ESD
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.012g
- Electronic Component
- 1
- Channel Count
- Electronic Component
- Cj- Capacitor
- 0.3pF
- Electronic Component
- BM0010077821
- Operating Temperature
- 55℃~+150℃
- Voltage
- 17V
- Electronic Component
- IEC 61000-4-2
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：PESD24VF1BLYL
1. 产品概述
PESD24VF1BLYL是Nexperia公司推出的一款汽车级ESD（静电放电）保护二极管。它设计用于在高温、高压和高频环境下对敏感电子元件提供稳健的保护。这款二极管采用SOD-882封装（DFN1006-2），非常适合表面贴装（SMD）应用，广泛应用于现代汽车电子、消费电子及其他要求高可靠性的场合。
2. 特性
- 高击穿电压：PESD24VF1BLYL的反向断态电压（典型值）为24V，最低击穿电压为24.5V。这一特性使其能够在较高的电压条件下工作，确保设备在遭受高压脉冲时，有效防止电路受到损坏。
- 快速响应时间：该器件具有优异的瞬态电流处理能力，能够承受高达1A的峰值脉冲电流（10/1000 µs波形），在瞬变电压事件发生时能够快速响应并提供保护。
- 低电容和优良的频率特性：在1MHz的测试条件下，PESD24VF1BLYL展现出仅为0.3pF的输入电容，这降到几乎可以忽略不计的水平，极大降低了在高速信号传输中的信号衰减和失真风险。
- 高工作温度范围：该器件的工作温度范围从-55°C到150°C，保证了在极端温度条件下的稳定性和可靠性，充分满足汽车等恶劣环境下的应用需求。
3. 应用场景
以下是PESD24VF1BLYL的主要应用领域：
- 汽车电子：汽车行业对电子保护器件的需求日益增长，尤其在车载计算机、仪表盘、传感器及控制装置等对ESD安全性要求极高的应用中。
- 消费电子：适用于各种便携式电子设备，如智能手机、平板电脑和笔记本电脑的USB接口及其他输入输出端口，确保其免受静电损坏。
- 工业设备：在工业控制系统中，PESD24VF1BLYL同样可以作为电磁干扰和静电放电的保护元件，保证设备的正常运行与安全。
4. 结论
PESD24VF1BLYL作为一款高性能汽车级ESD保护二极管，凭借其优良的电气特性和宽广的适用温度范围，无疑是现代电子设备设计中不可或缺的组成部分。无论是汽车、消费电子还是工业应用，都能够有效保护敏感组件，延长设备的寿命，提高接口的稳定性和可靠性。Nexperia凭借其卓越的研发能力与生产工艺，提供了一款值得信赖的ESD保护解决方案，满足不同用户对保护设备的苛刻要求。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
