Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
74HC4094D,653是Nexperia(安世)公司推出的一款高性能、低功耗的八位移位寄存器,采用16引脚的SO(Small Outline)封装,设计用于广泛的电子应用中,尤其是在数码电路和数据处理系统中。作为一种三态输出的逻辑元件,74HC4094D能够实现串行到并行的数据转换,适合用于数据传输、处理与存储等多种场景。
输出类型:三态输出使得多个74HC4094D可以在同一数据总线上工作,而不会相互干扰,这一特性尤其适合多设备的数据传输应用。
位数与寄存器类型:该芯片为8位移位寄存器,能够存储和转换8位二进制数据,适用于数据量相对较小的应用场景。
工作温度范围:其工作温度范围为-40°C至125°C,确保在严酷工作环境下的可靠运行,满足工业级应用的需求。
供电电压:供电电压范围为2V至6V,适应多种电源系统,极大地提高了设计灵活性,尤其是在低功耗设备中可以有效延长电池寿命。
封装与安装:采用表面贴装型(SMT)封装,方便在现代电子产品的高密度布局中进行集成和安装。
逻辑类型:属于HC(High-speed CMOS)系列,具备较高的开关速度和低功耗特性。与传统TTL逻辑器件相比,74HC4094D提供了更高的性能与效率,是速度和功耗的理想平衡。
74HC4094D广泛应用于以下领域:
总之,74HC4094D,653是Nexperia推出的高性能八位三态移位寄存器,凭借其卓越的技术特性与广泛的应用场景,成为现代电子设计中不可或缺的元件之一。无论是在高端消费电子、工业控制设备还是普通的数字信号处理系统中,74HC4094D都能够提供可靠的性能支持,助力工程师实现他们的设计目标。
关于该产品的详细规格和技术文档,建议查阅Nexperia官方网站或相关产品手册,以获取最新和最准确的信息。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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