WMSIC Electronic Components

Nexperia BZV55-C12,115 BZV55

ModelBZV55-C12,115
PackageSOD-80C
BrandNexperia
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
Nexperia BZV55-C12, 115
Type
NEXPERIA
Unit
Electronic Component
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
NEXPERIA
Electronic Component
BZV55-C12,115
Electronic Component
1
Package
SOD-80C
Electronic Component
Zener Diode
Electronic Component
±5%
Electronic Component
0.071g
Electronic Component
1
(Zzt)
25Ω
Electronic Component
BM0000281795
Diode
1
Current(Ir)
100nA@8V
Power Dissipation(Pd)
400mW
Electronic Component
11.4V~12.7V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:BZV55-C12,115 稳压二极管

一、产品简介

BZV55-C12,115 是由全球知名的电子元器件供应商 Nexperia(安世)推出的一款高性能稳压二极管。该元器件符合现代电子电路对精确电压稳定和低漏电流的需求,广泛应用于各类电子设备中的电源管理和过电压保护方面。其典型稳压值为12V,适合需要12V输出的各种应用场合。

二、基本参数

  • 精度:±5%
  • 稳压值(典型值):12V
  • 反向漏电流:100nA @ 8V
  • 最大功率:500mW
  • 电压 - 齐纳(标称值)(Vz):12V
  • 容差:±5%
  • 功率 - 最大值:500mW
  • 阻抗(最大值)(Zzt):25 Ohms
  • 电流 - 反向泄漏:100nA @ 8V
  • 电压 - 正向 (Vf):900mV @ 10mA
  • 工作温度范围:-65°C ~ 200°C
  • 安装类型:表面贴装型
  • 封装/外壳:DO-213AC, MINI-MELF, SOD-80
  • 供应商器件封装:LLDS;MiniMelf

三、产品特点

  1. 高稳定性:BZV55-C12,115 具有优良的电压稳定性,其稳压值维持在12V旁边,允许的波动范围仅为11.4V到12.7V,显示出其在各种环境条件下的可靠性和一致性。

  2. 低反向漏电流:该稳压二极管的反向漏电流非常低,仅为100nA @ 8V,适合用于高效能要求的电源管理解决方案,特别是在低功耗设备中,能够显著提升系统的整体效率。

  3. 高功率处理能力:最大功率达到了500mW,这使其在较高功率应用中依然具有良好的性能表现,能够满足严苛环境下的稳定工作需求。

  4. 宽工作温度范围:BZV55-C12,115 可在-65°C到200°C的温度范围内正常工作,适用于航空航天、汽车电子等对温度适应性要求高的应用。

  5. 优化的电气特性:最大阻抗为25Ω,可以有效降低信号干扰,提高电路的整体稳定性。其900mV的正向电压特性也使得在实际应用中,能够更好地兼容多种电路设计。

  6. 便捷安装:采用表面贴装型封装(LLDS及MiniMelf),适合现代自动化生产线的焊接和安装,能有效节省空间,并降低制造成本。

四、应用领域

BZV55-C12,115 稳压二极管广泛适用于以下应用领域:

  • 电源供应和稳压电路:在各种电源系统中,能够提供精准的电压稳定性,确保系统的安全可靠工作。
  • 过压保护电路:用于保护电路元器件不受电压突增和瞬时过压影响,提高整体设备的耐用性。
  • 消费电子产品:如手机、平板电脑、电视机等,广泛应用于这些设备的电源管理和信号处理电路中。
  • 汽车电子:满足汽车使用环境中对温度和电压波动要求的电子控制单元。
  • 工业自动化设备:在复杂环境下的设备控制及监测系统中,提升系统稳定性与可靠性。

五、总结

BZV55-C12,115 稳压二极管凭借其优异的性能指标和广泛的应用场景,为现代电子产品提供了可靠的电压稳定解决方案。无论是在消费电子还是在工业应用中,它的表现都将充分满足各种高要求条件,促进电子技术的进一步发展与创新。对于希望提升其电路设计可靠性与稳压性能的工程师而言,BZV55-C12,115 将是一个值得信赖的选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.