Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BC857BM,315是一款由安世(Nexperia)推出的高性能PNP型双极型晶体管(BJT),其设计特别适合于各种低功率放大和开关应用。该器件以其优越的电气性能和可靠的工作稳定性,广泛应用于工业控制、通信设备、消费电子及各种电路中。
晶体管类型:PNP
电流 - 集电极 (Ic):最大值为100mA
集射极击穿电压 (Vce):最高可达45V
Vce 饱和压降:在不同的基极电流(Ib)和集电极电流(Ic)下,最大值为400mV(测试条件:5mA和100mA)
集电极截止电流 (ICBO):最大可达15nA
DC电流增益 (hFE):最小为220,测试条件为2mA和5V
功率消耗最大值:150mW
跃迁频率:高达100MHz
工作温度范围:最高达150°C(TJ)
安装类型:表面贴装型
封装类型:SC-101, SOT-883,供应商器件封装为DFN1006-3
BC857BM,315特别适用于逻辑电平切换、音频信号放大及低电平信号处理场景。其高增益特性使得即使在低基极电流下亦能实现高集电极电流,从而有效提高了电路的效率。此外,低集电极截止电流使得该器件在待机状态下功耗极小,为移动设备和便携式电子产品提供了良好的电源管理方案。
由于其频率范围高达100MHz,BC857BM,315也可应用于高频信号处理场合,比如RF放大器以及调制解调器等设备。同时,BC857BM,315可通过表面贴装技术(SMT)便捷地集成到电路板中,满足现代电子设计对于空间和性能的要求。
BC857BM,315凭借其高达150mW的功率处理能力,能够支持多种高功率应用。同时,其封装形式(DFN1006-3)小巧,便于高密度电路布局。此外,工作温度范围可达150°C,使得此器件在高温环境下的可靠性和稳定性得以保障,适合用于要求苛刻的工业应用场合。
在电源管理方面,凭借其较低的饱和压降和超低的静态功耗,BC857BM,315极大地提高了系统的整体效率。这使得设计工程师能够在选择其他元器件时减少对电源设计的担忧,为复杂系统的设计带来了便利。
BC857BM,315 PNP三极管是安世公司为满足现代电子设备高效率低功耗需求而设计的一款卓越元器件。其广泛的应用领域和优越的技术规格使其成为设计者在选择PNP晶体管时的理想选择。无论是在支持音频信号放大、逻辑控制,还是在高频信号处理中,BC857BM,315都能提供可靠的性能和优越的可靠性,在不断发展的电子产业中,为创新提供了强有力的支持。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products