WMSIC Electronic Components

Nexperia BSH111BKR

ModelBSH111BKR
PackageSOT-23
BrandNexperia
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
Nexperia BSH111BKR
Type
NEXPERIA
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
NEXPERIA
Electronic Component
BSH111BKR
Electronic Component
1
Package
SOT-23
Electronic Component
1 N
Electronic Component
MOSFET
Electronic Component
0.035g
Electronic Component
1
Electronic Component
BM0003131698
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
364mW
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
55V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:BSH111BKR N通道MOSFET

BSH111BKR是由Nexperia(安世)公司生产的一款高性能N通道金属氧化物半导体场效应管(MOSFET)。它以其出色的电气特性和宽广的应用场景,成为众多电子电路设计中不可或缺的重要元器件。

基本参数

  • FET 类型:N通道
  • 漏源电压(Vdss):55V
  • 连续漏极电流(Id):210mA(在25°C的环境温度下)
  • 驱动电压:在4.5V下,趋近最大导通电阻(Rds On),实现高效导通。
  • 最大导通电阻(Rds On):4欧姆(@200mA,4.5V)
  • 漏极阈值电压(Vgs(th)):在250µA时,最大值为1.3V
  • 栅极电荷(Qg):在4.5V条件下,最大值为0.5nC,表现出较低的驱动功耗。
  • Vgs(最大值):±10V,允许在广泛的应用中灵活使用。
  • 输入电容(Ciss):在30V时,最多可达30pF,适合高频信号。
  • 功率耗散(Pmax):302mW(在25°C环境下)
  • 工作温度范围:-55°C至150°C,适应各种严苛环境条件。
  • 封装类型:表面贴装型,符合TO-236AB规格。
  • 器件封装:TO-236-3(也称SC-59或SOT-23-3),适合于空间受限的应用。

性能优势

BSH111BKR具备高效率和良好的热管理性能,尤其适合用于低功耗设备中。其较低的导通电阻和电流阈值,使得它在小信号处理和功率转换应用中表现突出。MOSFET的N通道设计使其在开关领域具备更低的开关损耗,同时提供更高的导通效率。

在现代电子设计中,BSH111BKR可广泛应用于各种电源管理和开关电路,例如:

  • 电池管理系统:用于实现动态负载开关,延长电池使用寿命。
  • 信号调理电路:作为信号放大器或开关,适用于传感器接口。
  • LED驱动电路:控制LED的开关和调亮度,使得照明系统更加高效。
  • 无线通信设备:在RF应用中,能够显著改善信号的灵敏度和强度。

工业应用

凭借其卓越的电气性和耐用性,BSH111BKR在工业应用领域也被广泛采用,如工业控制、自动化设备、机器人技术、以及高温环境中的医疗设备等。此外,由于其宽工作温度范围,该器件在极端环境下的可靠性使其适合航空航天和汽车电子等领域。

小结

总而言之,BSH111BKR N通道MOSFET以其优异的电特性和多功能应用能力,成为电子设计中的理想选择。Nexperia凭借良好的制造工艺和严格的质量控制,使得BSH111BKR具有高度可靠性,为用户提供了保障。无论是在消费类电子产品还是工业级设备中,该MOSFET都能为设计师和工程师提供高效、经济的解决方案,助力现代电子技术的发展。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.