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Nexperia PCMF2USB3SZ
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Nexperia PCMF2USB3SZ
- Type
- NEXPERIA
- Minimum package
- 4500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- NEXPERIA
- Electronic Component
- PCMF2USB3SZ
- Electronic Component
- 1
- Package
- UFBGA-10
- Electronic Component
- Common Mode Filter
- Electronic Component
- 0.027g
- Voltage
- 15kV
- Electronic Component
- 1
- Channel Count
- 4
- Electronic Component
- BM0000753116
- Operating Temperature
- 40℃~+85℃
- Voltage
- 5V
- Resistor(DCR)
- 3Ω
- Electronic Component
- Electronic Component
- Electronic Component
- 4500
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
PCMF2USB3SZ 产品概述
1. 产品背景
随着信息技术的快速发展，电子元器件的性能和可靠性成为了消费者关注的重点。在众多电子元器件中，滤波器作为信号处理与保护应用中不可或缺的部分，其重要性日益凸显。尤其是在USB接口及其他信号传输线的设计中，滤波器不仅能有效抑制高频干扰信号，还能保护敏感电路不受静电放电（ESD）的影响。Nexperia（安世）推出的PCMF2USB3SZ共模滤波器正是针对这一需求而设计。
2. 产品特性
PCMF2USB3SZ是一款高性能的共模滤波器，具备如下特点：
- 滤波器类型: 本产品属于信号线类型的滤波器，专为USB等高速信号传输设计。
- 线路数: 该滤波器支持4条信号线，满足多通道信号传输的需求。
- DC电阻: 最大DC电阻（DCR）为3欧姆。这一较低的电阻确保信号传输过程中的损耗最小，从而提高系统的整体效率。
- 工作温度范围: PCMF2USB3SZ的工作温度范围为-40°C到+85°C，适合各种严苛环境下应用。
- ESD特性: 该产品具备良好的抗静电放电能力，能够有效保护后端电路，延长设备寿命。
- 安装类型: 采用表面贴装型（SMD）安装，使得元件更加小型化，便于高密度电路板的布局。
3. 尺寸与封装
PCMF2USB3SZ的尺寸为0.062”长 x 0.046”宽 (1.57mm x 1.17mm)和最大高度0.024” (0.60mm)，其小型化设计非常适合现代电子设备中对空间的严格要求。该滤波器的封装类型为10-UFBGA，WLCSP，通过先进的封装技术，能够提供优秀的电气性能和可靠性。
4. 应用场景
PCMF2USB3SZ广泛应用于各种电子设备中，尤其是在USB接口、移动设备、消费电子产品和高速通信装置等领域。因为其卓越的信号完整性和抗干扰能力，该滤波器能够有效提升设备的整体性能，保障系统在复杂电磁环境中运行稳定。
5. 性能优势
与市场上其他同类产品相比，PCMF2USB3SZ展现出如下优势：
- 高可靠性: 在极端环境下仍能保持稳定性能，保障设备的可靠运行。
- 小型化设计: 节省空间，方便与其他元器件集成，适应高密度设计需求。
- 简化电路设计: 降低了系统设计的复杂性，使开发周期缩短。
6. 总结
Nexperia（安世）PCMF2USB3SZ共模滤波器为当今电子设备的信号处理提供了一个稳定、可靠的解决方案。凭借其小型化的设计、强大的EMI抑制能力和广泛的工作温度范围，该滤波器在各种应用中均能提供卓越表现。通过集成这一先进的滤波器，设计工程师能够有效提升产品的抗干扰性能，进而提高设备的可靠性和用户体验。选择PCMF2USB3SZ是推动您电子产品技术进步的重要一步。
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