Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Nexperia BZX585-C33,115 BZX585
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- Nexperia BZX585-C33, 115
- Type
- NEXPERIA
- Unit
- Electronic Component
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- NEXPERIA
- Electronic Component
- BZX585-C33,115
- Electronic Component
- 1
- Package
- SOD-523(SC-79)
- Electronic Component
- Zener Diode
- Electronic Component
- 0.06g
- Electronic Component
- 1
- (Zzt)
- 35Ω
- Electronic Component
- BM0058418058
- Diode
- 1
- Current(Ir)
- [email protected]
- Power Dissipation(Pd)
- 300mW
- Electronic Component
- 31.35V~34.65V
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：BZX585-C33,115 稳压二极管
一、产品背景
BZX585-C33,115 是一款由Nexperia（安世）公司制造的稳压二极管，广泛应用于电源管理、信号调节和电路保护等领域。稳压二极管，也称为齐纳二极管，主要用于提供稳定的参考电压或保护电路免受过电压损害。BZX585-C33,115 以其优越的性能和体积小巧的设计，在现代电子产品中得到了广泛的应用。
二、主要参数
电压特性：BZX585-C33,115 的标称齐纳电压（Vz）为33V，具有±5%的容差。这确保了在实际应用中，可以提供相对稳定的输出电压，满足大多数精密电路的要求。
功率与阻抗：该部件的最大功率为300mW，这使其在高功率应用中依然能够稳定工作。此外，其最大阻抗（Zzt）为80Ω，这意味着它在反向操作时能够保持较低的电阻，使稳压性能更优。
反向漏电流：在23.1V时，反向泄漏电流为50nA，这是一个非常低的值，表明其在稳压状态下的能量损失很小，适合长时间运行的低功耗电路。
正向电压：在其正向电流100mA下，BZX585-C33,115 的正向电压（Vf）为1.1V，保证了在正向工作时的低能耗设计。
工作温度范围：该稳压二极管具备广泛的工作温度范围，从-65°C到150°C，适应各种恶劣环境，使其在航空航天、汽车和工业应用中表现出色。
封装与安装：BZX585-C33,115 采用SOD-523封装，规格小巧，特别适合表面贴装（SMD）应用，节省电路板空间并提高整体设计的紧凑性。
三、应用场景
BZX585-C33,115 稳压二极管适用于广泛的应用场景，包括但不限于：
电源管理：可用于稳压电源中的输出电压稳定器，为下游电路提供稳定的电压源。
信号调节：在信号处理电路中，确保信号的稳定性，降低电路中的噪声影响。
电路保护：可用作过电压保护器件，防止不平稳电压对敏感组件的损坏，保护整体电路的可靠性。
LED 驱动电路：用于LED等负载的驱动，帮助保持恒定的工作电流，从而实现理想的亮度与性能。
四、总结
BZX585-C33,115 稳压二极管凭借其优良的电压稳定性、低反向泄漏电流和广泛的工作温度范围，为各种电子应用提供了理想的解决方案。该元件的紧凑设计使它能够在空间受限的应用中发挥重要作用，是现代电子设计中不可或缺的一部分。
无论是在消费电子、工业设备，还是在汽车电子中，BZX585-C33,115 的可靠性和性能使其成为众多设计师的首选组件。在追求高效率和低能耗的电子产品设计中，选择BZX585-C33,115将是确保电路性能的明智之选。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
