WMSIC Electronic Components

Nexperia HEF4094BT,653 HEF4094BT

ModelHEF4094BT,653
PackageSOIC-16
BrandNexperia
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
Nexperia HEF4094BT, 653
Type
SOIC-16
Unit
Electronic Component
Minimum package
2500 圆盘

Technical parameters

Electronic Component
to
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
NEXPERIA
Electronic Component
HEF4094BT,653
Electronic Component
1
Package
SOIC-16
Electronic Component
positions Register
Electronic Component
4000B
Electronic Component
0.345g
Electronic Component
1
Electronic Component
1
Features
Output
Electronic Component
BM0000003215
Operating Temperature
40℃~+125℃
Operating Voltage
3V~15V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:HEF4094BT,653 移位寄存器

HEF4094BT,653 是一款来自 Nexperia(安世)的高性能逻辑芯片,属于 4000B 系列。作为一款功能强大的移位寄存器,它专为实现串行至并行和并行至串行数据转换而设计,适合多种电子应用,尤其是在需要广泛数据处理的场景中。

主要特性

  1. 逻辑系列:HEF4094BT,653 属于 4000B 系列逻辑电路,支持高达 15V 的电源电压,兼容范围为 3V~15V。

  2. 移位寄存器:该芯片内含 8 位移位寄存器,可以实现数据的串行输入和输出,使其在串行至并行转换和并行数据存储方面表现出色。

  3. 三态输出: HEF4094BT,653 的输出为三态,有助于降低电路的功耗并提高系统的灵活性,使它可以在多种通信场景中有效使用。

  4. 工作环境: 本产品在-40°C至125°C的温度范围内稳定工作,适合在严苛环境下的应用如汽车电子、工业控制和通信设备。

  5. 表面贴装型封装: HEF4094BT,653 采用 16-SOIC(0.154",3.90mm 宽)封装,非常适合表面贴装技术(SMT),在占用空间小的前提下,方便与现代电路板的设计需求相匹配。

  6. 可广泛应用: 利用其串行至并行的数据转换能力,HEF4094BT,653 可用于多种数据处理应用,包括数据缓冲、数据转发、LED 驱动、数字信号处理、仪器仪表和自动化系统等。

应用实例

  • 数据传输: 作为串行至并行转换器,HEF4094BT,653 常用于数据传输需要的电路,例如在微控制器或数字信号处理器中,通过串行线传输数据并在寄存器内进行并行输出。

  • LED 控制: 该芯片的三态输出特性使其理想用于控制多组 LED 的开关状态,能够有效实现灯光效果的多样性和灵活性。

  • 缓冲/存储器应用: HEF4094BT,653 可以在需要临时存储数据的场合发挥作用,如在音频和视频处理、实时数据监测和信号接收等领域。

  • 仪表及传感器: 在各种传感器及仪表配置中,它可以作为数据积累及转换的核心,确保系统有效整合和利用多路输入信号。

性能与优势

HEF4094BT,653 的设计和技术优势,使其具备了出色的噪声抑制能力和耐高温性能,能够在不利环境中保持稳定运行。同时,功耗低、数据处理速度快、并行数据处理能力强,使其在现代电子设备中得到广泛应用。

结论

HEF4094BT,653 不仅是一款高性价比的移位寄存器,更是高性能电子系统不可或缺的重要组件之一。其在各种严苛应用环境下的多功能性和可靠性,使它在现代电子设计中展现了巨大的潜力。对于寻求高效、稳定和灵活数据处理解决方案的工程师和设计师来说,HEF4094BT,653 是一个理想的选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.