Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Nexperia BAS21AVD,135 BAS21AVD
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
17
specifications
Core information
- Product name
- Nexperia BAS21AVD, 135
- Type
- NEXPERIA
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- NEXPERIA
- Electronic Component
- BAS21AVD,135
- Electronic Component
- 1
- Package
- SOT-457
- Electronic Component
- Switch Diode
- Electronic Component
- 0.041g
- Electronic Component
- 1
- Electronic Component
- BM0084330562
- Current(Ir)
- 25nA@200V
- (Vf)
- 1.25V@200mA
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
- Voltage Rating(Vr)
- 200V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BAS21AVD,135 产品概述
一、概述
BAS21AVD,135 是由Nexperia（安世半导体）制造的一款高性能双极性开关二极管，采用表面贴装型封装（SOT-457）。凭借其卓越的电气特性和可靠性，BAS21AVD,135 广泛应用于各种电子电路中的信号处理、开关和整流应用。为工程师和设计人员提供了一种理想的解决方案，以满足不断发展的电子产品需求。
二、基本参数
二极管配置：BAS21AVD,135 配有3个独立的二极管，适用于多种应用场景，能够为单一芯片提供多种整流和开关功能。
类型和标准：此二极管为标准型二极管，适应性强，能够以较低的正向电压进行工作，适合低功率应用。
电压与电流：
- 最大反向电压(Vr)：200V，确保在高压环境下也能稳定运行。
- 平均整流电流(Io)：每个二极管的最大整流电流为200mA (DC)，支持较高的电流条件，适合流行电子产品如LED驱动、传感器电路等。
正向电压(Vf)：在200mA的工作条件下，二极管的正向电压为1.25V，优化了功耗表现，减少了在信号传输中能量的浪费。
反向恢复时间(trr)：仅50ns的反向恢复时间，确保快速开关能力，非常适合高频率应用，减少延迟，提高系统整体效率。
反向泄漏电流：在200V的反向偏置下，反向泄漏电流为100nA，这使得BAS21AVD,135具备良好的抗干扰能力，在静态条件下保持低功耗。
工作温度：BAS21AVD,135的结温最大可达150°C，确保在高温环境下的稳定性，扩展了其在工业及消费类设备中的应用范围。
三、设计与封装
BAS21AVD,135采用了TSOP-6封装，这种紧凑的设计使得其在空间受限的应用中表现出色。此外，SOT-457的表面贴装结构使得其在PCB设计中更为便捷，并且适合大规模生产，同时提高了产品的可靠性。
四、应用领域
BAS21AVD,135是一款性能强大的开关二极管，广泛应用于如下领域：
信号处理电路：用于快速开关控制，适合无线通信、音频信号处理等领域。
整流电路：在电源转换设备中作为整流二极管使用，提供高效的能量转换能力。
保护电路：可用于过压保护电路，有效防止其他元器件被高电压击穿。
LED照明：广泛应用于LED驱动电路，提升能效和光电转换的效率。
汽车电子：在各种汽车控制系统中作为保护器件，确保电子稳压和开关控制的可靠性。
五、总结
综上所述，BAS21AVD,135凭借优秀的电气性能、良好的散热能力和灵活的封装选择，是一种非常适合现代电子设计的开关二极管解决方案。它的广泛应用、高可靠性和优越的性能使其成为设计师和工程师在开发新项目时值得考虑的重要元器件。通过合理的应用，BAS21AVD,135可以有效提升电路性能，确保电子产品的稳定性和效率。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
