Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Nexperia BAS521,115 BAS521
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- Nexperia BAS521, 115
- Type
- NEXPERIA
- Unit
- Electronic Component
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- NEXPERIA
- Electronic Component
- BAS521,115
- Electronic Component
- 1
- Package
- SOD-523
- Electronic Component
- Switch Diode
- Electronic Component
- 0.032g
- Electronic Component
- 1
- Electronic Component
- BM0000286634
- Current
- 250mA
- Diode
- Electronic Component
- Current(Ir)
- 30nA@250V
- (Vf)
- 1V@100mA
- Power Dissipation(Pd)
- 500mW
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BAS521,115 产品概述
产品背景
BAS521,115是一款由国际知名半导体制造商Nexperia（安世）提供的高性能开关二极管，采用SOD-523封装，专为高效能、高可靠性的电子应用设计。该二极管在组件内部集成了多项先进技术，旨在用于广泛的电子电路场合，尤其是在需要低正向压降及快速开关性能的场合。
基本参数
BAS521,115的主要参数如下：
- 反向恢复时间（trr）: 50ns
- 直流反向耐压（Vr）: 300V
- 平均整流电流（Io）: 250mA
- 正向压降（Vf）: 1.1V @ 100mA
- 反向漏电流（Ir）: 150nA @ 250V
- 工作温度范围: -55°C至150°C
- 电容: 5pF @ 0V，1MHz
BAS521,115在执行开关功能时，以其标称的1.1V的低正向压降，提供卓越的电力效率，特别典型的应用如开关电源、整流电路以及信号整形电路，都能实现良好的性能表现。
封装与安装
BAS521,115采用SOD-523表面贴装封装，这种紧凑的封装形式不仅能够满足现代电子设备对空间的严格要求，还为高密度电路设计提供了便利。SOD-523封装具有良好的散热性能，适合高温环境使用，并能有效降低PCB布局的复杂性，增强整个电子系统的可维护性。
应用领域
BAS521,115的应用领域非常广泛，涵盖了从消费电子到工业控制再到通信设备的各个环节。具体应用包括：
- 开关电源: 在高频开关模式电源中，BAS521,115的快速恢复时间可显著提高效率，减少开关损失。
- 整流应用: 在整流电路中，该二极管能有效减少正向压降带来的功耗，提高整流器的输出性能。
- 信号切换: 在信号处理电路中，由于其低噪声特性，BAS521,115广泛应用于信号切换和信号调节电路。
- 保护电路: 为了保护敏感元件，BAS521,115可作为电压钳制元件，防止反向电流对元件造成损坏。
性能优势
BAS521,115在性能上表现优异，主要优势包括：
- 快速响应: 反向恢复时间仅为50ns，满足高频操作需求，适合快速开关电路。
- 低正向压降: 在100mA的工作电流下，正向压降仅为1.1V，有利于提升能效。
- 高耐压能力: 具有300V的直流反向耐压，提供良好的耐压保险，适用高压环境。
- 低反向泄漏电流: 在250V下仅为150nA，显著降低了系统待机功耗。
- 高工作温度范围: 工作结温可达150°C，适合高温及恶劣环境下的应用。
结论
总而言之，BAS521,115以其卓越的电气特性、紧凑的封装形式以及广泛的应用前景，已成为工程师们在设计高效可靠的电路时的优选器件。其在多种应用场合的表现，都证明了其作为标准二极管的极高价值，将继续在未来电子技术中发挥重要作用。选择BAS521,115，无疑是提升设备性能与可靠性的明智之举。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece Integrated Circuit for IRS20124S IRS21956S SOP-20 IRS2453DS SOP-14
- Model
- IRS20124S
- Package
