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Nexperia PMBD7100,215 PMBD7100
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- Nexperia PMBD7100, 215
- Type
- NEXPERIA
- Unit
- Electronic Component
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- NEXPERIA
- Electronic Component
- PMBD7100,215
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- Switch Diode
- Electronic Component
- 0.037g
- Electronic Component
- 1
- Electronic Component
- BM0227554504
- Current
- 215mA
- Diode
- 1
- Current(Ir)
- 2.5uA@100V
- (Vf)
- 1.25V@150mA
- Power Dissipation(Pd)
- 250mW
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
PMBD7100,215 产品概述
一、产品简介
PMBD7100,215 为 Nexperia（安世）推出的双二极管阵列，1 对共阴极（common cathode）配置，封装为 SOT-23（TO-236-3 / SC-59）。该器件针对空间受限且需中低功率整流与开关保护的场景设计，集成度高，便于表面贴装量产。
二、主要电气参数
- 正向压降 Vf：1.25 V @ 150 mA
- 直流反向耐压 Vr：100 V
- 直流整流电流（Io）：215 mA
- 耗散功率 Pd：250 mW
- 反向电流 Ir：2.5 μA @ 100 V
- 反向恢复时间 Trr：4 ns（适合高速切换）
- 非重复峰值浪涌电流 Ifsm：4 A（短时冲击能力）
三、性能亮点
- 高耐压与低反向泄漏：100 V 耐压和仅 2.5 μA 的反向电流，适合高压侧保护与小电流整流。
- 快速开关：4 ns 的反向恢复时间，适用于开关电源的高频整流和钳位。
- 紧凑封装：SOT-23 小型封装利于便携设备和高密度 PCB 布局。
四、封装与热管理
SOT-23 封装体积小，但热阻较大，额定耗散功率仅 250 mW（典型条件下）。在实际应用中应通过扩大焊盘铜箔面积与散热层（顶层或底层加铜）来改善热性能，并按环境温度对额定电流与功率进行降额（derating）。
五、PCB 布局与焊接建议
- 增大焊盘和连到散热平面的过孔数量，以降低结-环境热阻。
- 严格按照制造商回流焊曲线进行焊接，避免过高回流峰值温度导致封装应力。
- 在高速开关路径中尽量缩短走线，减少寄生电感，提高开关性能。
六、选型注意事项与典型应用
- 选型时关注实际工作电流与平均功耗，若长期接近额定 Io 或 Pd，需考虑并联或升级更大封装器件。
- 典型应用：小功率开关电源二次侧整流、整流保护、反向保护/OR-ing、信号整形与钳位、低功率充电器与适配器。
- 对于频繁冲击或高浪涌场合，应验证 Ifsm 与热冲击能力，必要时在电路中加入限流或缓冲元件。
总结：PMBD7100,215 在高耐压、快速恢复与小型封装之间取得平衡，适合要求体积小、开关速度快且电流需求在数百毫安级的多种保护与整流场景。选用时应重视热管理与工作点降额，确保长期可靠性。
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