WMSIC Electronic Components

Nexperia BZX384-C75,115 BZX384

ModelBZX384-C75,115
PackageSOD-323(SC-76)
BrandNexperia
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
Nexperia BZX384-C75, 115
Type
NEXPERIA
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
NEXPERIA
Electronic Component
BZX384-C75,115
Electronic Component
1
Package
SOD-323(SC-76)
Electronic Component
Zener Diode
Electronic Component
±5%
Electronic Component
0.032g
Electronic Component
1
(Zzt)
255Ω
Electronic Component
BM0227290364
Diode
1
Power Dissipation(Pd)
300mW
Electronic Component
70V~79V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZX384-C75,115 产品概述

一、概述

BZX384-C75,115 是 Nexperia(安世)出品的一款高压稳压二极管,标称稳压值 75V,额定耗散功率 300mW,封装为 SOD-323(也称 SC-76)。该器件针对低电流、高电压的基准与稳压应用设计,具有较低的反向漏电和稳定的动态阻抗,适合空间受限的贴片电路板。

二、主要电气参数

  • 标称稳压值(Vz):75V(允差 ±5%,实际稳压区间约 70V–79V)
  • 反向电流(Ir):50nA @ 52.5V(低电压下漏电小,有利于高阻电路)
  • 阻抗(Zzt):255Ω(表征小信号下的动态电阻,影响负载电流变化时的电压变动)
  • 耗散功率(Pd):300mW(器件在允许散热条件下的最大耗散功率)

三、使用注意与计算

  • 最大稳压电流近似:Iz(max) ≈ Pd / Vz = 300mW / 75V ≈ 4mA。因此该器件适合于毫安级以下的稳压或基准电路,长期工作时应在此值之下并留有裕量。
  • 动态电压变化:在小信号变化下,ΔV ≈ Zzt × ΔI。由于 Zzt = 255Ω,电流变化会对稳压值产生可观影响,设计时应保证电流稳定或采用更低阻抗的方案。
  • 限流与选择:常见做法是在输入端串联限流电阻 R = (Vin - 75V) / Iz 以限制通过稳压二极管的电流,保证不超过 Iz(max)。
  • 热管理:SOD-323 为小型塑封,散热能力有限,需注意PCB热阻和环境温度对 Pd 的影响,必要时采取降载或增加散热面积。

四、典型应用

  • 小电流电源的参考电压源与基准(如偏置网络、检测电路)
  • 高压测量与保护电路中作为电压钳位/基准元件(低功耗场景)
  • 仪器仪表中用于提供稳定高压偏置的元件(需配合限流)
    由于器件功率较低,不适合用作大电流浪涌吸收或替代瞬态抑制器。

五、封装与装配建议

SOD-323(SC-76)为常见的小型贴片封装,适合自动贴装与回流焊工艺。装配时注意:

  • 遵循供应商给出的回流焊温度曲线;避免超温导致性能退化。
  • 在 PCB 设计时为器件引脚留足焊盤面积与热铜量,以改善散热。
  • 储存与湿敏等级按照器件标准要求处理,湿度敏感元件需按回潮防护流程焊接。

六、选型建议

选择 BZX384-C75,115 时应确认实际工作电流远低于 4mA,并评估电路对稳压精度(±5%)与动态阻抗(255Ω)的容忍度。若需要更高稳定性或更大电流能力,应考虑功耗更高或具有更低动态阻抗的替代方案。购买时注意核对制造商型号与封装,以免混淆类似型号。

如需该型号的完整数据手册(包含测试条件、曲线和温度特性),建议下载 Nexperia 官方 Datasheet 以便精确设计与仿真。

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