WMSIC Electronic Components

Nexperia 74LVC08AD,118 74LVC08AD

Model74LVC08AD,118
PackageSOIC-14
BrandNexperia
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
Nexperia 74LVC08AD, 118
Type
NEXPERIA
Unit
Electronic Component
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
NEXPERIA
Electronic Component
74LVC08AD,118
Electronic Component
1
Package
SOIC-14
Electronic Component
Logic Gate
Electronic Component
74LVC
Electronic Component
0.254g
Electronic Component
1
Channel Count
4
Features
Electronic Component
Electronic Component
BM0084327942
Operating Temperature
40℃~+125℃
Operating Voltage
1.2V~3.6V
Logic Type
and Gate

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

74LVC08AD,118 产品概述

1. 概述

74LVC08AD,118 是一款高性能的四通道与门 (AND gate) 集成电路,属于 Nexperia(安世)品牌系列,采用表面贴装型 SO-14 封装。与门是数字电路中最基本的逻辑门之一,74LVC08AD,118 的设计和特性使其在多种电子应用中具备出色的性能和灵活性。

2. 基础参数

  • 逻辑电平: 该器件工作于逻辑高电平范围为 1.08V 至 2V,低电平范围为 0.12V 至 0.8V,适用于多种逻辑电平环境。
  • 工作电压: 供电电压在 1.2V 至 3.6V 范围,非常适合低功耗设备的应用。
  • 最大传播延迟: 在 3.3V、50pF 的条件下,该元器件的最大传播延迟为 4.1ns,适合高速逻辑应用。
  • 输入与输出特性: 具有 2 个输入端口,每个逻辑电平输出(高和低)支持最大 24mA 的输出电流,能够驱动较大负载。
  • 静态电流: 最大静态电流仅为 40µA,表明该器件在静态条件下的功耗极低,适合于能效敏感的设计。
  • 工作温度范围: 设备的工作温度范围为 -40°C 至 125°C,使其适用于恶劣环境中的应用。

3. 封装与安装

74LVC08AD,118 采用 14-SO 封装(SOIC-14),其尺寸为 3.90mm 宽,适合于多种年轻电子系统设计。表面贴装型设计使其能够轻松集成至现代 PCB 板中,有效节省板面积并简化生产过程。

4. 应用场景

74LVC08AD,118 可广泛应用于多种电子设备中,尤其在以下领域表现突出:

  • 通信设备: 高速信号处理和数据传输中,74LVC08AD 可用于实现滤波、选择和组合信号。
  • 消费电子: 在音视频设备、计算机周边以及其他消费电子产品中,作为逻辑控制元件,确保信号的可靠处理。
  • 工业自动化: 该器件稳定的工作特性及广泛的温度范围,使其成为工控领域的理想选择,能在极端环境中持续工作。
  • 汽车电子: 由于其高温耐受能力,74LVC08AD,118 也适用于汽车电子系统中,如传感器、控制单元等。

5. 设计优势

使用 74LVC08AD,118 的主要优势包括:

  • 提高设计灵活性: 提供多通道并行处理能力,简化电路设计。
  • 节能高效: 低静态电流和高输出能力使设计师能打造更为节能的系统。
  • 改善信号完整性: 适应较大的负载,同时保证良好的信号传输性能。

6. 总结

74LVC08AD,118 是一款功能强大且高度集成的四通道与门 IC,具有广泛的应用潜力和优越的工作特性。无论是在一般数字逻辑电路、通信系统,还是在更为复杂的嵌入式设备中,该器件都能够提供稳定可靠的性能。对于追求现代电子产品高效与灵活性的设计师而言,74LVC08AD,118 是一个理想的选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.