WMSIC Electronic Components

Nexperia BCW70,215 BCW70

ModelBCW70,215
PackageSOT-23
BrandNexperia
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
Nexperia BCW70, 215
Type
NEXPERIA
Unit
Electronic Component
Minimum package
3000

Technical parameters

Electronic Component
Electronic Component
Electronic Component
NEXPERIA
Electronic Component
BCW70,215
Electronic Component
1
Package
SOT-23
Electronic Component
1 PNP
Electronic Component
Transistor(BJT)
Electronic Component
0.025g
Electronic Component
1
Electronic Component
BM0227557945
Operating Temperature
65℃~+150℃
Transistor Type
PNP
Frequency(f T)
100MHz
Power Dissipation(Pd)
250mW
Electronic Component
3000
Collector Current(Ic)
100mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BCW70,215 产品概述

一、基本参数

BCW70,215 是一款由 Nexperia(安世)生产的 PNP 小信号三极管,封装为 SOT-23。主要电参数包括:直流电流增益 hFE = 215(测试条件 2mA, Vce=5V)、集电极电流 Ic 最大 100mA、集射极击穿电压 Vceo = 45V、特征频率 fT = 100MHz、耗散功率 Pd = 250mW、集电极截止电流 Icbo ≈ 100nA、射基极击穿电压 Vebo = 5V、饱和压 VCE(sat) ≈ 150mV。工作温度范围 -65℃ 至 +150℃。

二、主要特性

  • 高静态放大率:hFE=215(低电流条件下),适合要求高增益的前级放大与电平转换。
  • 低漏电流:Icbo 约 100nA,有利于高阻抗电路与低噪声设计。
  • 宽频率响应:fT 100MHz,可胜任音频至低射频的小信号放大。
  • 低饱和压与中等功耗:VCE(sat) ~150mV,有利于低压开关;Pd 250mW,SOT-23 封装下需关注散热。
  • 耐压适中:Vceo 45V,适合常见的低功率电源轨应用。

三、典型应用场景

  • 小信号放大器:音频前置放大、传感器前端、桥接放大电路。
  • 开关与电平转换:在低电压电源或互补对称设计中作为 PNP 侧开关或拉电流元件。
  • 模拟电路:偏置、负电源侧复位、反相器与推挽级驱动(配合 NPN)。
  • 通用电子设备:便携设备、仪表、低功耗控制板等。

四、设计与使用要点

  • 热量管理:SOT-23 的 Pd = 250mW 在 PCB 热阻影响下实际允许功耗需降额;高环境温度下应保证良好散热或限制集电极电流。
  • 电压限制:避免超过 Vebo = 5V 的基极-发射极反向电压;工作电压不要超过 Vceo = 45V。
  • 偏流设计:给定 hFE 测试条件为 Ic≈2mA、Vce=5V,实际电路中增益随 Ic、Vce 变化,需在设计时通过仿真或测量确认工作点。
  • ESD 与焊接:按常规 SMD 操作规范防静电,回流焊温度曲线遵循厂家推荐。

五、封装与采购建议

BCW70,215 以 SOT-23 小尺寸封装提供,适合自动化贴装与空间受限的 PCB 设计。采购时建议确认单颗或卷盘包装、温度等级与原厂出货证明。如用于批量或关键应用,建议向 Nexperia 询问完整数据手册并索取封装热参数与典型特性曲线以便精确设计。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.