WMSIC Electronic Components

Nexperia PMEG2010BER,115 PMEG2010BER

Nexperia PMEG2010BER,115 PMEG2010BER
1 / 3

Product image

ModelPMEG2010BER,115
PackageSOD-123W
BrandNexperia
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Send RFQ Contact customer service

Technical data

Product details

20 specifications

Core information

Product name
Nexperia PMEG2010BER, 115
Type
NEXPERIA
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
NEXPERIA
Electronic Component
PMEG2010BER,115
Electronic Component
1
Package
SOD-123W
Electronic Component
Schottky Diode
Electronic Component
0.052g
Electronic Component
1
Electronic Component
BM0000035253
Current
1A
Diode
1
Current(Ir)
50uA@20V
(Vf)
450mV@1A
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述：PMEG2010BER,115 - Nexperia肖特基二极管

PMEG2010BER,115 是Nexperia USA Inc. 生产的一款高性能肖特基二极管，具有卓越的电气特性和广泛的应用场景。这款二极管采用SOD-123W表面贴装型封装，旨在满足现代电子设备对稳定性、效率和占用空间的高要求。其主要特点如下：

主要技术参数

  • 制造商：Nexperia USA Inc.
  • 产品类型：肖特基二极管
  • 平均整流电流（Io）：1A
  • 最大直流反向电压（Vr）：20V
  • 正向电压（Vf）：在1A时，正向电压为450mV，提供优良的导电性能。
  • 反向泄漏电流：在20V时，仅为50µA，表现出良好的隔离性能。
  • 工作温度范围：最大结温可达150°C，适合高温环境中的应用。
  • 电容特性：在1V、1MHz下的电容为185pF，适用于高频和高速开关电路。
  • 速度：可在≤ 500ns的快速恢复时间内工作，适合快速开关的应用场合。

应用领域

PMEG2010BER,115肖特基二极管广泛应用于以下领域：

  1. 开关电源：得益于其低正向电压特性，能够有效提高电源转换效率，降低功耗。
  2. 整流电路：在整流应用中，PMEG2010的高整流电流和低反向泄漏特性使其成为理想选择，保证了整流电路的稳定性。
  3. 反向保护：适用于电源线的反接保护，能够防止由于错误连接导致的设备损坏。
  4. LED驱动电路：其快速恢复特性确保LED闪烁时不会产生明显延时，从而提高光效与用户体验。
  5. 信号整形：在信号处理和调制解调器应用中，PMEG2010可以用于信号整形，改善信号质量。

封装与安装

PMEG2010BER,115采用SOD-123W封装样式，使其具备极小的占用空间，便于在紧凑型电路板上进行集成。其表面贴装技术（SMT）也简化了制造和装配过程，提高了生产效率。同时，采用卷带（TR）包装，便于自动贴片机进行高效生产。

性能优势

  1. 低正向压降：低Vf不仅提高了能效，而且降低了热损耗，延长设备的使用寿命。
  2. 高温工作能力：支持高达150°C的工作温度，使其在工业级和高温环境中运行稳定。
  3. 快速恢复：合适的反向恢复时间使其能够高效处理高频信号，尤其在开关电源或高频应用中表现卓越。
  4. 优越的反向泄漏特性：低泄漏电流特性确保器件在关断状态下消耗更少的电流，提高系统的整体效率。

结论

PMEG2010BER,115是用于现代电子设计的一种理想选择，凭借其卓越的电性能、高可靠性以及小巧的封装，为工程师和设计师提供了灵活而高效的解决方案。无论是在电源管理、信号处理还是反向保护等多个应用中，PMEG2010都能充分满足市场需求，并为最终产品的性能提升作出显著贡献。无论是在消费电子、通信设备还是工业应用中，Nexperia的这一肖特基二极管都是提升设计品质的可靠伙伴。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.