WMSIC Electronic Components

Nexperia PZU3.0B2A,115 PZU3.0B2A

ModelPZU3.0B2A,115
PackageSOD-323
BrandNexperia
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
Nexperia PZU3.0B2A, 115
Type
NEXPERIA
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
NEXPERIA
Electronic Component
PZU3.0B2A,115
Electronic Component
1
Package
SOD-323
Electronic Component
Zener Diode
Electronic Component
±2%
Electronic Component
0.032g
Electronic Component
1
(Zzt)
95Ω
Electronic Component
BM0265831718
Diode
1
Current(Ir)
10uA@1V
Power Dissipation(Pd)
320mW
Electronic Component
2.95V~3.2V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PZU3.0B2A,115 产品概述

一、产品简介

PZU3.0B2A,115 是 Nexperia(安世)产的一款小功率稳压二极管,标称稳压值 3.0V,反向漏电流 Ir = 10 μA(在 1V 条件下),耗散功率 Pd = 320 mW,动态阻抗 Zzt = 95 Ω,封装为 SOD-323。该型号定位于低功耗、小体积的电压稳压与钳位应用,适合便携与空间受限的电子设备。

二、主要特性

  • 标称稳压:3.0V,适用于 3V 低压稳压或基准钳位。
  • 低电流漏泄:1V 条件下 Ir = 10 μA,适合电池供电与待机低功耗场合。
  • 中等功耗能力:Pd = 320 mW,表面贴装 SOD-323 封装需注意散热限制。
  • 较高动态阻抗:Zzt = 95 Ω,表明在小电流条件下电压随电流变化较敏感,适合低精度或低电流场合。

三、电气性能与设计要点

  • 最大稳压功耗对应的理论最大稳压电流 Iz_max = Pd / Vz ≈ 320 mW / 3.0 V ≈ 106.7 mA。但由于 SOD-323 的热阻与封装散热能力,实际连续工作电流不宜接近该值,应充分余量并参照器件温升与环境温度,通常在几毫安到十几毫安的范围内更为稳妥。
  • 由于 Zzt 较高,本器件在作为精密参考电源时表现有限,建议用于低电流稳压或作为信号钳位。
  • 典型偏置电阻计算(示例):若供电 5V,目标稳压 3V,期望稳流 Iz = 5 mA,则限流电阻 R = (5V − 3V) / 5 mA = 400 Ω。设计时应同时考虑负载电流与器件最小稳定电流。
  • 温度与散热:在高环境温度或靠近热源时需降额使用,必要时通过并联或更大封装器件提升功率能力。

四、封装与可靠性

SOD-323 为小型表面贴装封装,适合高密度 PCB 布局。焊接时应遵循厂家推荐的回流温度曲线与湿热存储(MSL)等级,保持良好焊点以降低热阻。搬运与安装过程中注意静电防护,避免击穿或参数漂移。

五、典型应用场景

  • 低功耗便携设备的局部 3V 电压稳压或基准源。
  • 信号线钳位与过压保护(限定幅值、保护后级电路)。
  • 传感器偏置、电平移位和简单参考源。
    不建议用于高精度基准或大电流稳压场合,若需低噪声与高稳定性,应选用专用电压基准芯片。

六、选型建议与可比器件

选择时关注工作电流范围、环境温度及散热条件。若要求更低动态阻抗或更高功耗,可考虑更大封装或专用线性稳压/基准器件。市场上常见的 3.0V 类别小功率稳压二极管(例如 BZT 系列中对应电压型号)可作为参数对比参考,但具体电气特性应以 Nexperia 官方数据手册为准。

总结:PZU3.0B2A,115 适合体积受限且工作电流较低的稳压和钳位应用,设计时应重视动态阻抗与封装散热限制,按应用场景合理选取偏置电流与热余量。请在最终设计前参照 Nexperia 官方数据手册获取完整参数与焊接规范。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.