WMSIC Electronic Components

Nexperia 74AUP1G38GM,115 74AUP1G38GM

Model74AUP1G38GM,115
PackageXSON-6(1x1.5)
BrandNexperia
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
Nexperia 74AUP1G38GM, 115
Type
NEXPERIA
Unit
Electronic Component
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
NEXPERIA
Electronic Component
74AUP1G38GM,115
Electronic Component
1
Package
XSON-6(1x1.5)
Electronic Component
Logic Gate
Electronic Component
74AUP
Electronic Component
0.034g
Electronic Component
1
Channel Count
1
Electronic Component
BM0227556056
Operating Temperature
40℃~+125℃
Operating Voltage
800mV~3.6V
Logic Type
and Gate
Current(IOL)
4mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

74AUP1G38GM,115 产品概述

一、概述

74AUP1G38GM,115 是 Nexperia(安世)推出的超低压、低静耗 CMOS 与非门(NAND),单片包含 1 个 2 输入逻辑元件,封装为 XSON-6(1.0 × 1.5 mm)。器件属于 74AUP 系列,支持极低工作电压并针对电池供电与低功耗系统优化设计,适合便携、物联网、消费类和工业级别的小体积逻辑接口应用。

二、主要特性

  • 逻辑类型:2 输入与非门(NAND),单通道(1 element)。
  • 工作电压范围:0.8 V ~ 3.6 V,适配单节锂电/低压数字域。
  • 超低静态电流(Iq):约 900 nA(典型),有利于待机功耗控制。
  • 输出驱动:下拉/灌电流 IOL = 4 mA(建议用于小信号驱动或作为逻辑级联)。
  • 传输延迟(tpd):约 7.5 ns(在 VCC = 3.3 V,CL = 15 pF 时)。
  • 工作温度:-40 ℃ ~ +125 ℃ 满足工业级要求。
  • 封装:XSON-6(1 × 1.5 mm),非常适合对 PCB 面积敏感的应用。

三、电气性能亮点

  • 输入阈值与兼容性:VIH 给出 1.6 V(典型)/2.0 V(条件阈值),VIL 给出 900 mV / 700 mV(视测量条件或规范项不同)。在设计时应依据实际 VCC 和器件数据手册的额定阈值选择输入电平,确保可靠识别高低电平。
  • 输出低电平(VOL):典型 500 mV,结合 IOL 可在低压域提供确定的低电平驱动。
  • 极低待机电流使该器件非常适合电池供电、能耗敏感的终端设备。

四、应用场景与选型建议

  • 便携设备与移动终端:单节电池或 1.8 V~3.3 V 电源系统中作为逻辑门和门阵列的补充。
  • 物联网节点与可穿戴设备:待机功耗要求高、面积受限的 PCB 设计。
  • 信号整形与门控逻辑:用于简单控制逻辑、复位/使能信号整合。
    选型时若需驱动较大负载(如继电器、指示灯或长线驱动),建议搭配功率缓冲驱动器,因为 IOL = 4 mA 属于小信号驱动能力。

五、封装与 PCB 布局注意事项

  • XSON-6 超小封装要求在布局时注意焊盘与热焊盘(若有)的设计规范,保证焊接可靠性与散热。
  • VCC 旁尽量靠近放置 0.1 µF 去耦电容,减小电源回路寄生和瞬态噪声。
  • 对于长输入线或存在干扰的环境,考虑在输入端增加适当的缓冲、滤波或上拉/下拉电阻以避免毛刺误触发。

六、典型使用提示

  • 在低电压(接近 0.8 V)工作点下,应通过实验验证输入阈值与时序是否满足系统要求,因阈值与驱动能力随 VCC 变化敏感。
  • 关注器件在工业温度范围内的延迟与阈值漂移,关键路径建议留裕量。
  • 若需实现电平兼容(例如与 5 V 侧接口),应使用专用电平翻译器或确保输入保护方案,避免超压。

总结:74AUP1G38GM,115 在极低电压与低静耗场景下表现优异,适合对面积、功耗敏感的小信号逻辑应用。在实际设计中需注意输出驱动能力与输入阈值随电压的变化,合理布板与去耦可保证稳定可靠的系统表现。

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