WMSIC Electronic Components

Nexperia 74HC04D,653 74HC04D

Model74HC04D,653
PackageSOIC-14
BrandNexperia
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
Nexperia 74HC04D, 653
Type
NEXPERIA
Unit
Electronic Component
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
NEXPERIA
Electronic Component
74HC04D,653
Electronic Component
1
Package
SOIC-14
Electronic Component
Inverter
Electronic Component
74HC
Electronic Component
0.254g
Electronic Component
1
Electronic Component
1
Channel Count
6
Electronic Component
BM0000285022
Operating Temperature
40℃~+125℃
Operating Voltage
2V~6V
Current(IOH)
5.2mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:74HC04D,653 反相器 IC

基本信息

74HC04D,653 是一款由安世(Nexperia)出品的高性能反相器集成电路,属于 74HC 逻辑系列。此器件采用 14-SOIC 封装,适用于各种逻辑电路设计,广泛应用于电子产品的信号处理、数据转换和逻辑控制等领域。

技术规格

  • 电源电压范围:2V ~ 6V,适应多种电源配置,确保在广泛的电压条件下可靠工作。
  • 逻辑装置:该器件为6通道反相器,具有低电压逻辑特性,能够实现高效的信号反转。
  • 输入/输出特性:
    • 输入数:6
    • 电流静态(最大值):2µA,表现出极低的功耗特性,适合于电池供电设备。
    • 输出电流(高/低):5.2mA,保证了在传送信号时的有效驱动能力。
  • 逻辑电平:
    • 低电平范围:0.5V ~ 1.8V
    • 高电平范围:1.5V ~ 4.2V,确保在不同的电源电压下逻辑信号的正确识别。
  • 最大传播延迟:在 6V 时,最大传播延迟为 14ns, CL = 50pF。这使得该 IC 在高速逻辑电路中的应用更为理想,实现快速的信号传递。
  • 工作温度:-40°C ~ 125°C,适合于各种严苛的环境条件,具有极强的抗环境干扰能力。
  • 封装类型:14-SOIC,尺寸为 0.154英寸(3.90mm 宽),适合于多种 PCB 布局,支持表面贴装技术,方便在现代电子设备中的集成。

应用场景

74HC04D,653 反相器具有多种应用场景。它可用于:

  1. 逻辑电路设计:在数字电路中广泛用作反相器,转换输入信号的逻辑状态。
  2. 信号整形:用于信号整形和调整,能够消除噪声,改善信号质量。
  3. 接口电路:作为不同逻辑电平间的接口,将不同电平的信号进行转换,提升系统兼容性。
  4. 时序电路:在时序控制电路中,74HC04D,653 可用来处理和调整信号的时序,确保同步操作。

设计优势

  1. 低功耗:由于其静态电流低至 2µA,非常适合于低功耗及便携设备的设计需求。
  2. 广泛的电压范围:其工作电压范围广泛,能够适应不同的应用场景。
  3. 高速度:14ns 的最大传播延迟充分满足当今频率需求高的应用,为设备提供快速反应能力。
  4. 可靠性:其设计符合工业标准,能够在极端温度条件下稳定工作,增强了产品的可靠性。

总结

74HC04D,653 是一款高性能、低功耗的 6 通道反相器 IC,具备广泛的电源电压范围和可靠的性能指标,适用于各类电子设备和系统的逻辑运算和信号处理需求。无论是工业设备、消费电子,还是医疗设备,74HC04D,653 都能通过其卓越的性能为设计人员提供强有力的支持,为实现更高效、更可靠的电路设计奠定基础。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.