Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
74LVC00APW,118 是一款属于 74LVC 系列的与非门逻辑芯片,由 Nexperia(安世)公司制造。该芯片采用了先进的 CMOS 技术,专为低电压和高性能应用而设计。其工作电压范围在 1.2V 至 3.6V 之间,满足现代数字电路对低功耗的需求。这款与非门具有低静态电流和高输出驱动能力,是高速逻辑电路设计的理想选择。
低功耗设计: 74LVC00APW,118 采用的 CMOS 技术确保了在各种供电电压下都能实现低功耗,尤其是在静态状态下,最大静态电流仅为 40µA。这对于电池供电或需要能效优化的应用尤为重要。
高驱动能力: 每个输出端口的驱动能力高达 24mA,能够直接驱动多个后级负载,减少外部元件的需求,简化电路设计。
广泛的电压工作范围: 本产品的工作电压范围从 1.2V 到 3.6V,使其在多种不同的电源电压条件下都能有效工作,特别适合现代数字电路和低电压应用。
快速的信号处理能力: 最大传播延迟为 4.3ns,在 3.3V 和 50pF 负载下提供了较快的响应时间,能够支持高速逻辑电路的需求。
广泛的工作温度范围: 74LVC00APW,118 可以在 -40°C 到 125°C 的环境中运行,适用于各种严苛的工作条件,适合汽车电子、工业控制和消费电子等多种应用场景。
紧凑的封装: 14-TSSOP 封装设计使得芯片体积小,便于在有限空间内集成,适合现代小型和高密度电路板设计。
由于以上特性,74LVC00APW,118 可广泛应用于以下领域:
74LVC00APW,118 是一款高性能、低功耗的与非门逻辑芯片,其出色的电流驱动能力和快速的传播延迟使其成为电子设计中不可或缺的重要元件。广泛的工作电压和温度范围加上紧凑的封装,确保了其在各类应用场景中的有效性与可靠性,是现代数字电路设计的理想之选。无论是在新产品开发,还是在现有系统的优化中,这款芯片都提供了极大的灵活性和设计自由度。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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