WMSIC Electronic Components

Nexperia BUK9K52-60E,115 BUK9K52

Nexperia BUK9K52-60E,115 BUK9K52
1 / 2

Product image

ModelBUK9K52-60E,115
PackageLFPAK56D
BrandNexperia
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Send RFQ Contact customer service

Technical data

Product details

20 specifications

Core information

Product name
Nexperia BUK9K52-60E, 115
Type
NEXPERIA
Unit
Electronic Component
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
NEXPERIA
Electronic Component
BUK9K52-60E,115
Electronic Component
1
Package
LFPAK56D
Electronic Component
2 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.182g
Electronic Component
1
Electronic Component
BM0084330603
Operating Temperature
55℃~+175℃
Power Dissipation(Pd)
32W
Electronic Component
Electronic Component
Electronic Component
1500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述：BUK9K52-60E,115

概述

BUK9K52-60E,115是一款高性能双N沟道场效应晶体管（MOSFET），由英特尔旗下的Nexperia（安世）公司研发和生产。此MOSFET专为高效率功率管理应用而设计，能够在广泛的工作条件下保证卓越的性能，其片划线封装（LFPAK56D）使得该器件适用于表面贴装，便于在紧凑的电路设计中应用。

核心参数

  1. 导通电阻（RDS(on)）：该器件在特定条件下的导通电阻为49毫欧，测试条件为5A，10V。这一较低的导通电阻使得BUK9K52-60E,115在开关状态下能显著减少功耗和发热，提升整机的能效及稳定性。

  2. 漏极电流（Id）：BUK9K52-60E,115可在25°C条件下连续承受高达16A的漏极电流，使其适用于需要大电流驱动的应用场景，如电源管理和DC-DC转换器。

  3. 漏源电压（Vdss）：该MOSFET可在最大60V的漏源电压下安全工作，适用于多种功率转换和开关应用。

  4. 栅极阈值电压（Vgs(th)）：BUK9K52-60E,115在1mA漏电流下的栅极阈值电压最大为2.1V，此特点使其非常适合逻辑电平控制，进而简化电路设计。

  5. 输入电容（Ciss）：在25V的测量条件下，该器件的输入电容为725pF，低输入电容可实现更快的开关速度，降低开关损耗。

  6. 栅极电荷（Qg）：在10V的条件下，BUK9K52-60E,115的栅极电荷最大值为10nC，优异的阈值电压和工作电荷同时保证了较低的驱动功耗。

  7. 工作温度范围：该器件能够在-55°C至175°C的宽工作温度范围内正常工作，满足严苛环境下应用的需求，特别适用于汽车电子和工业控制等要求高温稳定性的应用。

应用场景

BUK9K52-60E,115广泛适用于以下领域：

  • 开关电源：凭借其低导通电阻和高电流承载能力，该MOSFET是高效开关电源设计中的理想组件，能够有效减小功率损耗，提高系统的整体效率。
  • 电机驱动：对于电机驱动应用，其高漏电流和低导通电阻能保证电机启动和运行的平稳性。
  • 电池管理系统（BMS）：在电池充放电和保护电路中，该器件的高效能确保了电池的安全和寿命。
  • 工业自动化设备：其良好的温度稳定性和高频响应特性，使其成为自动化控制领域中的重要组件。

封装与特性

BUK9K52-60E,115采用SOT-1205封装，符合LFPAK56D标准，具有良好的散热特性和电气性能。此封装形式不仅降低了安装空间，还优化了产品在热管理和电气连接方面的表现。

结论

总结来说，BUK9K52-60E,115 MOSFET凭借其优异的电气性能、广泛的工作温度范围和高效的热管理特性，非常适合于现代电子产品的高效能设计及应用。无论是高效开关电源、工业控制系统还是电动汽车等场景，BUK9K52-60E,115都能为设计工程师提供灵活、可靠的解决方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.