WMSIC Electronic Components

Nexperia BZX84-B39,215 BZX84

ModelBZX84-B39,215
PackageSOT-23(TO-236AB)
BrandNexperia
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
Nexperia BZX84-B39, 215
Type
SOT-23(TO-236AB)
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
NEXPERIA
Electronic Component
BZX84-B39,215
Electronic Component
1
Package
SOT-23(TO-236AB)
Electronic Component
Zener Diode
Electronic Component
±2%
Electronic Component
0.025g
Electronic Component
1
(Zzt)
40Ω
Electronic Component
BM0227554420
Diode
1
Power Dissipation(Pd)
250mW
Electronic Component
38.2V~39.8V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZX84-B39,215 产品概述

一、产品简介

BZX84-B39,215 是 Nexperia(安世)出品的一款独立式稳压二极管,标称稳压值为 39V,封装为 SOT-23(TO-236AB)。该器件属于小功耗、低漏电的稳压二极管(Zener/菊石二极管)系列,适合在体积受限的电路中作为基准稳压、钳位或保护元件使用。典型应用包括电源辅助偏置、信号钳位、电路保护及便携设备的参考电压源等。

二、主要参数与电气特性

  • 稳压值(标称):39V
  • 稳压值范围:38.2V ~ 39.8V(相当于约 ±2.05% 的公差)
  • 反向电流 Ir:50 nA @ 27.3 V(低漏电,有利于高阻抗/待机场景)
  • 动态阻抗 Zzt:40 Ω(影响稳压点随电流变化的线性斜率)
  • 耗散功率 Pd:250 mW(器件在规定条件下的最大耗散功率)
  • 器件配置:独立式(二极管为单只独立器件)
  • 封装:SOT-23(小型表面贴装)

注:具体测试条件(如测试电流 Iz,test、环境温度)请参照 Nexperia 官方数据手册,以获得完整参数描述与典型曲线。

三、性能亮点

  • 低漏电:在 27.3 V 时反向电流仅 50 nA,适用于对漏电敏感的高阻抗输入或低功耗待机电路。
  • 小体积封装:SOT-23 兼顾占板面积小与可焊性,适合便携设备和高密度 PCB 设计。
  • 较低的动态阻抗(40 Ω):在小电流范围内可以提供相对稳定的电压参考,便于在偏置、限压场景应用。
  • 明确的功耗限制:Pd = 250 mW,便于在设计中计算最大允许电流与热管理。

四、典型应用场景

  • 电源偏置与参考:作为 39 V 的局部参考或偏置点(注意功耗限制,通常用于低电流场合)。
  • 电压钳位与瞬态保护:用于限制过电压到安全范围,保护下游器件。
  • 仪表与测量电路:低漏电特性使其适合高阻输入电路的参考/保护。
  • 通信与信号链路:阻止信号在异常高压时损坏敏感芯片或接口电路。

五、设计与选用建议

  • 最大稳压电流计算:在无额外散热的条件下,最大直流稳压电流约为 Iz,max = Pd / Vz = 250 mW / 39 V ≈ 6.4 mA。实际应用中不建议长期在该电流点工作,应预留裕量并根据工作温度降额。
  • 工作点选择:为了获得更稳定的稳压特性并控制发热,推荐将工作电流选择为远小于 Iz,max 的数 mA 级或更低(例如 0.1–2 mA),同时参考厂家给出的 Iz vs Vz 曲线以获得最佳稳压性能。
  • 动态响应:动态阻抗 40 Ω 意味着电流的小幅波动会引起相应的电压变化(ΔV ≈ Z · ΔI);例如电流变化 1 mA 会引起约 40 mV 的稳压变化。若需高精度参考,应配合串联限流或采用外部稳压环路。
  • 串联限流电阻:在用于钳位或参考时,建议串联合适的限流电阻以限制通过稳压二极管的电流,避免超过功耗上限。限流电阻可按 R = (Vin - Vz) / Iz 计算(其中 Iz 选择为安全的工作电流)。

六、封装与热管理

  • SOT-23 的热阻和散热能力有限,250 mW 的额定功耗是在典型 PCB 与环境条件下给定的极限值。实际应用时应注意热源集中、器件间距与底层铜箔扩散等热设计因素。
  • 推荐在 PCB 布局时为 SOT-23 的焊盘配置适量铜面以增强散热,必要时参考厂家应用笔记的降额曲线与热阻数据。

七、注意事项与可靠性建议

  • 温度降额:器件在高环境温度下需要按数据手册进行功耗降额,避免长期在高温且接近 Pd 的条件下工作,以延长可靠性。
  • 测试条件核对:使用时应核对厂家给出的测试电流和测试条件(例如 Iz,test)以正确解读稳压值与动态阻抗等参数。
  • 替代与兼容:选择替代器件时需匹配稳压值、功耗、动态阻抗与封装;若电路对漏电特别敏感,应优先选择标称漏电更低的型号或使用外部缓冲。
  • 焊接与存储:遵守 SMD 器件的回流焊工艺规范与防潮存储要求,防止焊接热损伤与湿度相关的封装问题。

总结:BZX84-B39,215 以其 39 V 稳压、低漏电与小体积封装,适用于低功耗、体积受限的稳压、钳位与保护场景。设计时需注意功耗和热管理,合理选择工作电流并参考厂商数据手册的完整电气与热特性曲线以保证可靠运行。

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