WMSIC Electronic Components

Nexperia BAL74,215 BAL74

ModelBAL74,215
PackageSOT-23
BrandNexperia
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
Nexperia BAL74, 215
Type
NEXPERIA
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
NEXPERIA
Electronic Component
BAL74,215
Electronic Component
1
Package
SOT-23
Electronic Component
General Purpose Diode
Electronic Component
0.015g
Electronic Component
1
Electronic Component
BM0265831709
Current
215mA
Diode
Electronic Component
Current(Ir)
100nA@50V
(Vf)
1.25V@150mA
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:BAL74,215 二极管

基本信息

BAL74,215 是一款基于 Nexperia 公司的高可靠性标准二极管,采用了先进的表面贴装技术(SMD),封装类型为 TO-236AB,亦称为 SC-59 或 SOT-23-3。该产品的设计旨在满足多种电子应用的需求,特别是在那些对电气特性有严格要求的场合。其直流反向耐压(Vr)为 50V,平均整流电流(Io)为 215mA,符合大多数通用电子设备的使用标准。

电气性能

BAL74,215 的正向压降(Vf)为 1.25V(在 150mA 的工作条件下),这表明该二极管在承受较高电流时仍能保持较低的功耗。此外,该二极管具有快速恢复特性,反向恢复时间(trr)为 4ns,这使得它在高频应用中显示出极佳的性能。其反向泄漏电流在 50V 时低至 100nA,表现出优异的电气孤立性。

工作温度与可靠性

BAL74,215 具有较高的工作温度范围,其结温最大可达 150°C,使得该二极管在高温环境下仍能稳定工作。这种特性对于那些工作在恶劣环境下的电子设备尤为重要,比如汽车电子、工业控制等领域。通过采用高质量的材料和先进的制造工艺,Nexperia 确保了该产品的耐用性和长期稳定性。

物理特性

该二极管的体积小巧(TO-236AB 封装),对于空间受限的应用尤为适合。在现代紧凑型电子设备中,二极管的尺寸和安装方式是设计工程师日益关注的因素。BAL74,215 的表面贴装特性不仅便于自动化生产,还提高了组装效率,降低了总体生产成本。

应用场景

BAL74,215 可以广泛应用于很多电子电路中,包括但不限于:

  • 电源整流:在直流电源转换中充当整流器,有效将交流电转换为直流电。
  • 信号整流:用于小信号处理电路中的整流应用,比如无线电、音频放大器等。
  • 反向电压保护:作为保护二极管,防止设备在意外连接反向电压时受到损害。
  • 开关电路:在开关电源或其他开关电路中,作为快速开关元件进行信号的开关控制。

结论

总的来说,BAL74,215 二极管在现代电子设备中扮演着重要角色,其卓越的电气特性、可靠的工作温度范围以及紧凑的封装设计,使其成为一款理想的选择。无论是在要求严苛的工业应用,还是在追求高性能的消费电子产品中,BAL74,215 都能够提供稳定的性能和高效的解决方案。通过选择这款由 Nexperia 提供的二极管,设计工程师能够确保其产品的可靠性与效率,为客户提供更好的使用体验。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.