Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Nexperia BZX384-C22,115 BZX384
Configuration
1 options
Configuration
Electronic Component
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- Nexperia BZX384-C22, 115
- Type
- NEXPERIA
- Unit
- Electronic Component
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- NEXPERIA
- Electronic Component
- BZX384-C22,115
- Electronic Component
- 1
- Package
- SOD-323
- Electronic Component
- Zener Diode
- Electronic Component
- ±5%
- Electronic Component
- 0.021g
- Electronic Component
- 1
- (Zzt)
- 20Ω
- Electronic Component
- BM0265821983
- Diode
- 1
- Current(Ir)
- [email protected]
- Power Dissipation(Pd)
- 300mW
- Electronic Component
- 20.8V~23.3V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：BZX384-C22,115 稳压二极管
概述 BZX384-C22,115 是由 Nexperia USA Inc. 生产的一款高性能稳压二极管，其设计目的是提供稳定的电压参考和有效的过压保护。此器件采用 SOD-323 封装，具有优良的散热性能和极小的占板面积，非常适合现代电子设备的紧凑设计。BZX384-C22,115 的标称齐纳电压为 22V，工作温度可在 -65°C 至 150°C 范围内使用，兼具可靠性和耐高温性能，适合于广泛的应用场景。
关键参数
- 制造商：Nexperia USA Inc.
- 零件状态：有源
- 封装类型：表面贴装型
- 封装尺寸：SC-76, SOD-323
- 工作温度：-65°C 至 150°C
- 齐纳电压 (Vz)：22V
- 齐纳电压范围：20.8V 至 23.3V
- 功率最大值：300mW
- 阻抗 (Zzt)：55 Ohms
- 反向泄漏电流：50nA @ 15.4V
- 正向电压 (Vf)：1.1V @ 100mA
- 容差：±5%
功能与应用 BZX384-C22,115 稳压二极管可以在各种电子电路中应用，包括但不限于：
- 电源稳压：在电源电路中，BZX384-C22 提供参考电压，确保电源输出稳定，避免因电压波动而导致的电路损坏。
- 过压保护：该器件可以在突发电压高于其标称值时有效钳制电压，保护后级电路和敏感元件，特别是在汽车电子和工业设备中应用广泛。
- 调节电压：用于实现某些设备的电压调节功能，确保其工作在指定的电压范围内，提升产品的可靠性和稳定性。
特性优势
- 高精度与低泄漏：典型的反向泄漏电流仅为 50nA，这使得 BZX384-C22 适用于低功耗应用，确保节能效果。
- 宽工作温度范围：满足 -65°C 至 150°C 的广泛工作温度，使其在极端环境下的可靠性显著提升。
- 强抗干扰性：BZX384-C22 具有较好的阻抗特性（最大值 55 Ohms），可有效抑制由电源噪声引起的干扰。
- 紧凑封装：SOD-323 封装不仅占用空间小，还便于自动化贴装，提升生产效率。
总结 作为一款高效稳定的稳压二极管，BZX384-C22,115 在各类电子设备的电源管理和过压保护中表现优异。其小巧的 SOD-323 封装及高温工作特性，使其在现代电子设计中显得尤为重要。无论是在消费类电子、工业控制，还是汽车电子领域，BZX384-C22,115 都是一个值得信赖的选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
