Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TJA1057T/1Z TJA1057T
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- NXP TJA1057T / 1Z
- Type
- NXP
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- NXP
- Electronic Component
- TJA1057T/1Z
- Electronic Component
- 1
- Package
- SOP-8
- Type
- CAN Transceiver
- Electronic Component
- CAN Transceiver
- Electronic Component
- 0.266g
- Electronic Component
- 1
- Channel Count
- 1
- Features
- ESD; TXD
- Electronic Component
- BM0220417538
- Operating Temperature
- 40℃~+150℃
- Operating Voltage
- 4.75V~5.25V
- Operating Current
- 70mA
- Data
- 5Mbps
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TJA1057T/1Z 产品概述
一、产品简介
TJA1057T/1Z 是 NXP（恩智浦）推出的一款高性能 CAN 总线收发器，专为需高可靠性以及广泛温度范围下的通讯应用而设计。作为一种表面贴装型设备，它结合了半双工连接方式的优点，具有极低的功耗和强大的抗干扰能力，能够有效满足现代汽车以及工业自动化设备中的通讯需求。此产品特别适合需要工作温度范围广泛的环境，能够在-40°C 到 150°C 的温度范围内稳定工作。
二、技术规格
- 安装类型: 表面贴装(SMT)
- 双工类型: 半双工
- 工作温度范围: -40°C 至 150°C
- 数据传输速率: 最高支持 5 Mbps
- 供电电压: 4.75V 至 5.25V
- 类型: 收发器
- 通信协议: CANbus
- 接收器滞后: 300mV
- 驱动器/接收器数量: 1/1
- 封装类型: SOP-8
三、功能特点
半双工通信： TJA1057采用半双工通信设计，适用于需多节点协调通讯的网络架构，支持高效的消息传递。
宽广的工作温度范围： TJA1057具备的-40°C至150°C的工作温度范围，使其非常适合于汽车应用，尤其是在恶劣环境下的工业设备，确保收发器在不同温度条件下的稳定性和可靠性。
高数据传输速度： 其支持的高达5 Mbps的数据速率，能够满足高速通讯的需求，提升系统的吞吐量。
低功耗设计： TJA1057 由于其优秀的电源管理能力，在待机和运行状态下均表现出色，有助于设备的能效优化和延长电池寿命。
抗干扰能力： 作为CAN总线收发器，TJA1057具有优秀的抗电磁干扰能力，确保在有噪声的电磁环境内稳定工作，增强整个系统的可靠性和稳定性。
简单的接口： 使用业界标准的SOP-8封装，集成简便，便于在电子电路中实现设计和布局。
四、应用场景
TJA1057T/1Z 收发器可广泛应用于：
汽车电子： 在汽车内部网络，如引擎控制单元、传动系统和车身电子控制模块中，实现快速、可靠的通讯。
工业自动化： 在工业环境中，TJA1057可用于现场总线网络，支持工控设备、传感器和执行器间的高速数据交互。
智能建筑： 可用于智能控制系统，如楼宇自动化中的照明、温度监控和安防系统，提升建筑的智能性和能效。
新能源汽车： 在电动和混合动力汽车中，TJA1057能够帮助实现电池管理系统、能量分配系统和动力控制模块之间的高效通信。
五、总结
TJA1057T/1Z 收发器是现代电子通讯领域中不可或缺的一部分，凭借其半双工通信、高速数据传输、宽温度运行范围及低功耗等特点，成为在复杂通讯环境中保持高效和稳定的理想选择。无论是在汽车电子、工业自动化还是智能建筑系统中，TJA1057都能够为设计工程师提供灵活可靠的解决方案，满足日益增长的工业和汽车市场需求。随着科技的进步，TJA1057的应用前景将更加广阔，为各种现代设备提供稳健的通讯支持。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
