Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TEA1733T/N1,118 TEA1733T
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- NXP TEA1733T / N1, 118
- Type
- NXP
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- NXP
- Electronic Component
- TEA1733T/N1,118
- Electronic Component
- 1
- Package
- SOIC-8
- Electronic Component
- AC-DC Controllers and Regulators
- Electronic Component
- 0.193g
- Electronic Component
- 1
- Features
- (OTP); (UVP); (OVP); (OCP)
- Electronic Component
- Electronic Component
- Electronic Component
- BM0258853453
- Electronic Component
- CCM
- Operating Temperature
- 40℃~+150℃
- Operating Voltage
- 12.2V~30V
- Switching Frequency
- 66.5kHz
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TEA1733T/N1,118 产品概述
一、简介
TEA1733T/N1,118 是恩智浦（NXP）推出的一款反激式隔离型 AC‑DC 控制器与稳压器，专为小功率隔离电源设计。器件工作在连续导通模式（CCM），典型开关频率为 66.5kHz，适用于需要高集成保护和成本敏感的辅助电源、适配器及工业控制电源方案。
二、主要规格与功能
- 工作电压范围：12.2V ~ 30V（偏置/供电范围，需结合应用电路确认）。
- 开关频率：66.5kHz（典型），便于变压器与磁性元件设计。
- 最大占空比：72%，支持较宽的输出调节范围。
- 耗散功率 Pd：0.5W，器件自身热耗需在 PCB 设计时考虑散热。
- 拓扑：反激式（flyback），适合单次或多次输出的隔离电源设计。
- 封装：SOIC‑8，便于批量贴装。
三、保护与可靠性
TEA1733 提供全面保护功能：过热保护（OTP）、欠压保护（UVP）、过压保护（OVP）、过流保护（OCP）及软启动。保护策略有助于提升系统安全性与可靠性，适应工业级恶劣工作环境。器件允许结温范围为 -40℃ ~ +150℃（Tj），符合高温应用需求。
四、热管理与散热建议
由于 Pd 典型为 0.5W，PCB 需要通过加宽铜箔、增加热过孔或放置在靠近外壳的区域来降低结温。SOIC‑8 封装热阻相对较高，长时间满载运行应留有足够散热裕度并进行热仿真验证。
五、设计注意事项
- 变压器设计：根据 66.5kHz 与 72% 最大占空比来确定匝比与磁芯选择，注意保证边界导通条件与续流裕度。
- 开关管与钳位：选择合适的功率 MOSFET 或内部驱动配合外部钳位网络以吸收反冲能量，防止次级整流器损伤。
- 反馈回路：采用光耦或初级侧稳压反馈方案时，布局应尽量缩短反馈环路并配置滤波与补偿元件以保证稳定性。
- 抗干扰：输入滤波与共模电感设计要兼顾 EMI 要求与器件工作稳定性。
六、典型应用场景
- 开关电源辅助电源（SMPS auxiliary）
- 机顶盒、电视、家电的低功率隔离电源
- 工业控制设备与通信备电模块
- 充电器、小型适配器以及需要多输出分配的隔离供电
七、选型与实施建议
在选型时，应结合系统最大负载、效率目标与温升约束来评估 TEA1733 的适配性。对于高效率需求，可优化磁性材料与开关器件；对高可靠性场合，应重视过流与热保护的触发门限设置与调试。建议在样机阶段做完整的短路、过载与热冲击验证，确保保护动作与热裕度满足最终产品规范。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
