WMSIC Electronic Components

PCA9554PW,118 PCA9554PW

ModelPCA9554PW,118
PackageTSSOP-16
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
NXP PCA9554PW, 118
Type
NXP
Unit
Electronic Component
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
PCA9554PW,118
Electronic Component
1
Package
TSSOP-16
Electronic Component
I / O Expander
Electronic Component
0.168g
Electronic Component
1
I / O
8
Features
positions; and
Electronic Component
BM0257638415
Operating Temperature
40℃~+85℃
Operating Voltage
2.3V~5.5V
Interface Type
I2C;SMBus
Current(IOH)
10mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PCA9554PW,118 产品概述

PCA9554PW,118 是 NXP(恩智浦)推出的一款低功耗 8 位 I/O 扩展器,采用 TSSOP-16 封装,支持 I2C 与 SMBus 总线通讯。器件适配电源电压范围 2.3V ~ 5.5V,工作温度范围 -40℃ ~ +85℃,可为微控制器提供额外的并行 I/O 口,适用于工业控制、消费电子与便携式设备等场景。

一、主要特性

  • 8 位通用 I/O 口,可独立配置为输入或输出。
  • I2C / SMBus 接口,支持最高时钟频率 400 kHz(Fast-mode)。
  • 器件地址位允许级联最多 8 个相同设备,扩展更大 I/O 数量。
  • 具有中断输出,便于事件驱动的输入检测,减少轮询开销。
  • 工作电压范围广:2.3V ~ 5.5V,适配多种系统电压。
  • 极低静态电流 Iq:约 250 nA,适合电池供电与低功耗设计。
  • 封装:TSSOP-16(PCA9554PW,118)。

二、电气性能要点

  • 下拉导通能力(IOL,sink):24 mA(单引脚承受下拉负载能力)。
  • 上拉输出能力(IOH,source):10 mA(单引脚源电流能力)。
  • 输出电平:输出高电平 VOH 指标可达到 4.0 V(视 VCC 与负载而定);输出低电平 VOL 约 500 mV(在指定 IOL 下)。
  • 时钟频率上限 400 kHz,兼容 SMBus。
    这些参数在实际设计中需结合 PCB 散热与总线阻抗考虑,不宜长期将各引脚推到极限电流。

三、功能与寄存器概览

PCA9554 通常提供几类寄存器:输入端口寄存器、输出端口寄存器、极性反转寄存器与配置寄存器(方向控制)。通过 I2C 读写这些寄存器可以读取输入状态、设定输出、反转逻辑或配置某位为输入/输出,从而实现灵活的 I/O 管理。中断口在检测到配置的输入变化后可触发主机响应,降低系统轮询负担。

四、典型应用

  • MCU I/O 扩展:在管脚有限的单片机上扩展按键、开关、指示灯等控制线。
  • 键盘扫描、工控信号采集与驱动低电流负载(继电器或 MOSFET 驱动需外接驱动器)。
  • 电池设备:凭借超低静态电流,适用于长待机的便携或远程终端。

五、设计建议

  • I2C 总线需使用合适阻值的上拉电阻(常见 4.7kΩ ~ 10kΩ),根据总线容量与速度调整。
  • 在 VCC 旁并联 0.1 µF 陶瓷去耦电容以保证稳定性与瞬态响应。
  • 若需驱动高电流或感性负载,应在 I/O 端增加外部驱动与保护;注意 VOH/VOL 在大电流时会下降。
  • 中断输出常用为开漏/开集电极结构(需外部上拉),建议在 MCU 侧配置中断输入并加滤抖处理。
  • 多器件级联时,注意 I2C 地址配置与总线负载,确保时钟与数据线的信号完整性。

PCA9554PW,118 提供简单可靠的 8 位 I/O 扩展能力,低功耗与宽电压特性使其在多种系统中易于集成,是常见的微控制器外设扩展选择。若需更详细的时序、寄存器描述与典型电路图,请参阅 NXP 官方数据手册。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.