WMSIC Electronic Components

PCA9509DP,118 PCA9509DP

ModelPCA9509DP,118
PackageTSSOP-8
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

15 specifications

Core information

Product name
NXP PCA9509DP, 118
Type
NXP
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
PCA9509DP,118
Electronic Component
1
Package
TSSOP-8
Electronic Component
Converter / Level positions
Electronic Component
0.066g
Electronic Component
1
Features
Output; Integrated Resistor
Electronic Component
BM0254021888
Electronic Component
Electronic Component
Electronic Component
2500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PCA9509DP,118 产品概述

一、主要特性

PCA9509DP,118 是来自 NXP(恩智浦)的一款双通道双向缓冲/转接驱动器,封装为 TSSOP-8。器件工作电压范围为 3.0V ~ 5.5V,输出类型为开漏(open-drain),每个元件含 2 位通道,可用于 I2C/SMBus 类开漏总线的缓冲、隔离或电平匹配。典型工作频率支持至 400 kHz,传播延迟约为 109 ns(在 3.3V、50 pF 负载下测得),允许在工业温度范围(-40℃ 至 +85℃)下可靠运行。

二、功能说明

PCA9509 提供两路双向开漏通道,能够在总线两侧实现无源方向透明的信号传递并降低上位总线负载。开漏输出特性意味着器件本身不提供上拉,需在两侧电网上各自配备上拉电阻。器件的设计有利于抑制负载电容带来的信号畸变并改善上拉驱动能力,典型灌电流(IOL)为 6 mA,适合驱动常见上拉电阻和中等负载。

三、典型应用

  • I2C/SMBus 总线缓冲与隔离,延长总线长度或分割总线段
  • 不同电压域之间的电平适配(3.3V 与 5V 系统之间)
  • 多主或多从拓扑中减小总线负载、改善信号完整性
  • 嵌入式系统、传感器接口、工业控制和消费类电子

四、关键电气参数

  • 工作电压:3.0 V ~ 5.5 V
  • 工作温度:-40 ℃ ~ +85 ℃
  • 输出类型:开漏(需外部上拉)
  • 通道数:2 通道(双向)
  • 灌电流 IOL:6 mA(典型)
  • 传播延迟 tpd:109 ns @ 3.3 V,50 pF 负载
  • 支持总线频率:最高约 400 kHz(视系统负载和上拉配置而定)

五、封装与外形

PCA9509DP 采用 TSSOP-8 封装,适合表面贴装工艺,封装体积小,利于空间受限的应用板设计。使用时请参照恩智浦提供的封装机械图和焊盘推荐布局以确保良好焊接与热性能。

六、设计建议与注意事项

  • 由于输出为开漏,务必在每一侧总线接入合适的上拉电阻;上拉阻值取决于总线电容、期望上升时间和允许功耗,常见取值为 1 kΩ ~ 10 kΩ。
  • 当总线电容较大或总线较长时,适当减小上拉电阻以满足上升时间,但注意增加的静态功耗与开关瞬态电流。
  • 为降低干扰和改善信号完整性,可在器件输入端或总线上并联小阻或 RC 滤波器(依据系统性能要求调整)。
  • 在高速或噪声敏感应用中,最小化关键信号走线长度,靠近器件放置去耦电容(如 0.1 µF)并良好接地。
  • 检查系统中各侧的参考地是否良好连接,以防因地差导致通信异常。

如需在特定拓扑或极端工况下使用(如多主、高容抗负载或电平跨越场景),建议参考恩智浦完整数据手册并进行实验验证,以确保时序和电气特性满足系统需求。

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