WMSIC Electronic Components

NX3L1T3157GMZ

ModelNX3L1T3157GMZ
PackageSOT-886
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
NXP NX3L1T3157GMZ
Type
NXP
Unit
Electronic Component
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
NX3L1T3157GMZ
Electronic Component
1
Package
SOT-886
Electronic Component
60MHz
Electronic Component
Analog Switch / Multiplexer
Electronic Component
0.2g
Electronic Component
1
Channel Count
1
Features
Analog; ESD
Electronic Component
BM0264920015
Operating Temperature
40℃~+125℃
Operating Voltage
1.4V~4.3V
Switch
2:1

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

NX3L1T3157GMZ 产品概述

一、产品简介

NX3L1T3157GMZ 是恩智浦(NXP)系列的小型单通道 SPDT 模拟开关,封装为 SOT-886(6XSON)。该器件为双向模拟通道设计,适用于在低电压供电环境中进行信号路由与切换,提供稳定、无毛刺的通断性能,并具备 ESD 保护以增强系统可靠性。

二、主要特性

  • 开关类型:2:1 单通道(SPDT)
  • 双向模拟通道,支持双向信号传输
  • 导通电阻(Ron):500 mΩ(典型)
  • 工作电压:1.4 V ~ 4.3 V,适合电池供电和低压数字系统
  • 导通电容(Con):130 pF
  • 导通时间(ton):40 ns;关闭时间(toff):20 ns
  • 带宽:60 MHz(-3 dB 近似)
  • 工作温度范围:-40 ℃ ~ +125 ℃
  • 无毛刺切换(glitchless switching)与集成 ESD 保护

三、性能解读

导通电阻 500 mΩ 能在多数低频与中频模拟信号传输中保持较低的插损,但在精密测量或高功率应用需考虑压降与热耗散。130 pF 的开关电容与 60 MHz 的带宽共同决定了在高频(射频)场景下的衰减与相位响应,应根据目标频段评估信号完整性。40 ns/20 ns 的切换速度适合多数音频、视频和控制信号切换需求。

四、典型应用

  • 音频/视频信号路由与多路复用
  • 便携式设备的外设选择与信号切换(耳机/扬声器切换)
  • 数据采集通道选择、仪表和传感器路由
  • 低功耗便携系统和电池供电设备

五、封装与布局建议

SOT-886(6XSON)小型封装有利于高密度 PCB 布局,但对走线寄生电容和散热有要求。建议:

  • 在开关附近放置去耦电容并保持地平面连续性;
  • 信号走线尽量短、阻抗一致,避免与高速信号交叉;
  • 对于需要更好热管理或频率响应的应用,考虑在布局上减少并联寄生电容并保持良好接地。

六、使用注意事项

  • 确保控制逻辑电平在器件的工作电压范围内(1.4 V~4.3 V);
  • 在高频或高精度应用中,评估 Ron、Con 与系统带宽的匹配,必要时可通过外部缓冲降低影响;
  • 关注 ESD 保护规范,PCB 设计中加入保护元件以增强系统鲁棒性;
  • 工作环境温度超出 -40 ℃~+125 ℃ 时,需采取热管理或选择其他器件。

七、总结

NX3L1T3157GMZ 以小型封装、双向模拟通道、无毛刺切换和内置 ESD 保护为特点,适合音视频路由、便携设备及一般信号切换场景。在设计中需关注导通电阻与开关电容对信号质量的影响,并按推荐的布局和电源规范进行布线与去耦,以发挥最佳性能。

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