WMSIC Electronic Components

PCAL6408AHKX

ModelPCAL6408AHKX
PackageSOT-1161
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
NXP PCAL6408AHKX
Type
NXP
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
PCAL6408AHKX
Electronic Component
1
Package
SOT-1161
Electronic Component
I / O Expander
Electronic Component
0.888g
Electronic Component
1
I / O
8
Features
Built-in LEDDriver; positions; and; IOLevel
Electronic Component
BM0234453023
Operating Temperature
40℃~+85℃
Operating Voltage
1.65V~5.5V
Interface Type
I2C;SMBus
Current(IOH)
10mA
Current(IOL)
25mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PCAL6408AHKX 产品概述

一、概述

PCAL6408AHKX 是恩智浦(NXP)推出的一款低功耗、可编程 8 位 I/O 扩展器,采用 I²C/SMBus 接口,支持高达 400 kHz 的总线速率。器件工作电压宽(1.65 V ~ 5.5 V),工作温度范围 -40 ℃ ~ +85 ℃,并提供中断输出以便在引脚状态变化时通知主控,适合消费电子、工业控制、便携设备等需要扩展 GPIO 数量的应用场景。封装为 16 引脚 XQFN(1.8 × 2.6 mm,SOT-1161)的小尺寸封装,便于紧凑型系统集成。

二、主要功能与关键参数

  • 接口类型:I²C / SMBus,支持标准/快速模式(高达 400 kHz)。
  • I/O 数量:8 路可编程通用 I/O。
  • 中断输出:有中断输出,可在输入/引脚状态变化时触发,节省主机轮询开销。
  • 输出类型:支持开漏与推挽式配置(可配置输出行为以适应不同负载与互连需求)。
  • 电气特性:工作电压范围 1.65 V ~ 5.5 V,静态电流典型值 1 μA(低静态功耗,适合电池供电场景)。
  • 驱动能力:低电平下单引脚吸收电流 IOL 可达 25 mA;高电平输出源电流 IOH 可达 10 mA(适合直接驱动小型指示灯或作为控制信号驱动下游器件)。
  • 支持设备数量:通过地址选择可在同一总线上并联最多 2 个相同器件(地址选择位受限,实际并联数目受器件地址脚数决定)。
  • 工作温度:-40 ℃ 至 +85 ℃,满足商用与工业级温度需求。
  • 封装:16 引脚 XQFN(1.8 × 2.6 mm),封装标识 SOT-1161,利于空间受限设计。

三、寄存器与配置(概要)

PCAL6408AHKX 提供用于输入读取、输出设置、方向配置和中断/极性控制的寄存器集合(常见 IO 扩展器功能模块)。通过 I²C 主机读写相应寄存器可以完成:

  • 将各引脚配置为输入或输出;
  • 读取输入引脚的实时状态;
  • 写入输出寄存器设置各引脚电平;
  • 配置中断使能/屏蔽以及输入极性翻转等(便于与不同传感器或按键逻辑配合)。

(注:具体寄存器地址与位定义请参阅器件数据手册以获取精确控制细节。)

四、典型应用场景

  • 键盘矩阵或按键扫描扩展:结合中断功能可实现低功耗按键唤醒与快速响应;
  • 指示灯、继电器驱动的控制信号扩展(注意各引脚驱动能力与外部驱动级联);
  • 传感器与外设状态采集:将多个开关、传感器信号汇聚到单一 I²C 总线;
  • 低压系统电平扩展:支持 1.65 V 起的低电压系统,便于与低压 MCU 直接互联。

五、设计注意事项

  • 上拉电阻:若将 I/O 配置为开漏输出或作为输入时,请根据总线与负载条件合理选取外部上拉电阻。I²C 总线本身需外部上拉到 VCC。
  • 电源与旁路:为保证稳定性,VCC 侧应放置合适的去耦电容(如 0.1 μF 陶瓷)靠近器件电源引脚。
  • 总线速率与电容:400 kHz 工作下,I²C 总线负载电容与上拉阻值需保证时序完整,避免总线畸变或通信错误。
  • 中断处理:中断为开漏/有源低(需上拉),MCU 端需配置相应中断服务例程并在中断后读取寄存器清除中断标志。
  • 热与电流限制:单引脚 IOL/IOH 有上限,若驱动较大电流或多个引脚同时驱动高电流负载,应评估器件热耗散与系统散热。
  • 地址配置:若需并联多个同型号器件在同一总线上,请确认地址引脚配置规则(本型号支持最多 2 个设备并联,具体见数据手册)。

六、封装与系统集成建议

PCAL6408AHKX 的小尺寸 XQFN 封装适合空间受限的 PCB 布局。布板建议:

  • 电源、地平面尽量完整以降低噪声;
  • SCL、SDA 与中断线短而直,避免长线耦合;
  • 在靠近器件的电源引脚处放置去耦电容,必要时在 I/O 边缘加保护元件(TVS、串阻)以增强抗 ESD 与抗干扰能力。

总结:PCAL6408AHKX 为一款功能完善、低功耗、工作电压范围宽且易于集成的 8 路 I²C/SMBus I/O 扩展器,适合需要扩展 GPIO 数量且对功耗、封装尺寸有要求的多种嵌入式应用。欲了解详细寄存器映射、电气特性曲线及典型应用电路,请参考恩智浦官方数据手册与参考设计。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.