Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TJA1052IT/5Y TJA1052IT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- NXP TJA1052IT / 5Y
- Type
- NXP
- Unit
- Electronic Component
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- NXP
- Electronic Component
- TJA1052IT/5Y
- Electronic Component
- 1
- Package
- SOIC-16-300mil
- Type
- CAN-FDTransceiver
- Electronic Component
- CAN Transceiver
- Electronic Component
- 0.596g
- Electronic Component
- 1
- Channel Count
- 1
- Features
- ESD; TXD
- Electronic Component
- BM0231053616
- Operating Temperature
- 40℃~+125℃
- Operating Voltage
- 3V~5.25V
- Operating Current
- 70mA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
NXP TJA1052IT/5Y 产品概述
一、产品简介
TJA1052IT/5Y 是恩智浦（NXP）面向汽车和工业总线应用的 CAN-FD 收发器，支持高达 5 Mbps 的数据速率，适配 CAN-FD 性能要求。器件工作电压范围为 3.0 V 至 5.25 V，工作温度覆盖工业级 -40 ℃ 至 +125 ℃，封装为 SOIC-16 (300 mil)，为需要可靠差分通信和宽工作条件的系统提供物理层接口。
二、主要参数与特点
- 数据速率：最高可达 5 Mbps，满足 CAN-FD 高速数据帧需求。
- 工作电压：3.0 V ～ 5.25 V，兼容 3.3 V 与 5 V 系统。
- 工作温度：-40 ℃ ～ +125 ℃，适用于严苛环境。
- 静态电流：典型 5.6 mA（工作态），低功耗设计利于车辆与便携设备。
- 封装：SOIC-16 (300 mil)，便于 PCB 设计与大批量生产。
- 品牌：NXP（恩智浦），在汽车电子领域有广泛应用与长期支持。
三、典型应用场景
- 汽车车身控制单元（BCM）、车门、车窗及座椅控制模块。
- 网关与域控制器中的车载 CAN-FD 网络互联。
- 车载诊断、信息娱乐系统（IVI）与远程信息处理（telematics）。
- 工业自动化与运动控制等需要差分总线通讯的场合。
四、典型引脚功能（概述）
常见的引脚功能包括电源引脚（VCC、GND）、差分总线引脚（CANH、CANL）、逻辑接口（TXD、RXD）、模式或休眠控制（STB/EN）及速率/模式设置（RS/控脚）。在设计时，应参考厂商详细数据手册以获取准确引脚排列与功能说明。
五、典型电路与设计建议
- 在 CANH 与 CANL 之间放置 120 Ω 终端电阻以匹配总线阻抗。
- 电源引脚建议并联去耦电容（例如 0.1 µF 与 1 µF）以抑制噪声。
- 为实现睡眠与唤醒功能，可在 STB/EN 引脚上使用 MCU 控制或外部电平电路。
- 布线注意差分对对称、短距离并避免噪声源附近走线；接地要可靠以降低共模干扰。
六、封装、可靠性与采购信息
TJA1052IT/5Y 提供 SOIC-16（300 mil）封装，适合自动化贴装与波峰/回流焊接。器件满足汽车级工作温度与电压规范，适用于长期运行环境。采购时请优先通过 NXP 授权分销商或正规渠道，注意批号与包装形式（托盘/卷带）以满足生产需求。
备注：以上为基于器件核心参数的产品概述，具体电气特性、引脚定义、故障保护功能（如短路、热关断、ESD 抗扰度）及应用电路示意请参照 NXP 官方数据手册与应用说明书以获得完整规范与推荐布局。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
