WMSIC Electronic Components

KTY82/220,215 KTY82

ModelKTY82/220,215
PackageSOT-23
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
NXP KTY82 / 220, 215
Type
NXP
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
KTY82/220,215
Electronic Component
1
Package
SOT-23
Electronic Component
PTCThermistor Resistor
Electronic Component
0.037g
Electronic Component
2kΩ
Electronic Component
1
Electronic Component
BM0264600230
Operating Temperature
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

KTY82/220,215 产品概述

注:本概述基于提供的基础参数(阻值 2 kΩ;工作温度 -55 ℃ 至 +150 ℃;描述:THERMISTOR PTC 2K OHM TO236AB;品牌:NXP;封装:SOT-23)。为便于工程选型与设计,下面给出器件特性、应用、封装与电路建议及使用注意事项,具体电气参数请以厂方数据表为准。

一、产品简介

KTY82/220,215 系列为 NXP 出品的 PTC 热敏电阻(正温度系数热敏元件),封装为 SOT-23(同 TO‑236AB)。器件在常温下标称阻值约 2 kΩ,随温度上升阻值增加,适用于温度检测、过温报警与温度补偿等用途。SOT-23 小封装便于表面贴装,适配现代电子产品对体积和自动化组装的需求。

二、主要性能与特点

  • 阻值:标称 2 kΩ(通常指 25 ℃ 附近阻值,具体公差和温度系数见数据手册)。
  • 工作温度范围:-55 ℃ 至 +150 ℃,覆盖工业级测温及高温环境应用。
  • 封装:SOT-23(TO‑236AB),适合表面贴装与自动化生产。
  • 温度响应:PTC 特性(阻值随温度单调上升),适合做温度报警和补偿;需要通过标定或查表进行精确测量。
  • 品牌与质量:NXP(恩智浦)供应链与品质控制成熟,适合批量制造与长期供货。

三、典型应用场景

  • 工业温度监测与过温保护:控制器、变频器、功率模块附近的温度检测与限温保护。
  • 家用电器与HVAC:电机、加热器、热交换器的温度检测与控制。
  • 电池管理与充电设备:电池包或充电器中的温度监控与热补偿。
  • 测量与控制系统:作为传感元件接入 ADC 或比较器实现温度采样与阈值触发。
  • 温度补偿电路:与其他元件共同实现随温度变化的参数补偿。

四、电路接口与设计建议

  • 测量方法:常用的方式是将热敏电阻与已知上拉/下拉电阻组成分压电路,将分压点接入 ADC 或比较器读取电压并换算为温度。由于器件为 PTC,阻值随温度上升,分压方向与极性需按设计确认。
  • 上拉/下拉电阻选择:建议上拉电阻选用与 2 kΩ 同量级或更大,如 1 kΩ 至 10 kΩ 区间常用值(常见取 2.2 kΩ、4.7 kΩ)。阻值选择影响测量灵敏度与功耗,需在测量分辨率与自发热之间权衡。
  • 校准与线性化:PTC 元件通常非完全线性,应通过查表、查表插值或用二次/三次多项式拟合来线性化输出。推荐至少进行两点校准(低温点与高温点),关键应用建议做三点或更多点校准以提高精度。
  • 自发热与测量频率:连续测量与驱动电流会导致元件自加热,影响测量值。对于高精度应用,建议降低测量电流、降低采样频率或使用脉冲测量来减小自热误差。

五、封装与 PCB 布局要点

  • SOT-23(TO‑236AB)体积小、热容量低,热耦合快,适合需要快速响应的场合。
  • 布局建议:将器件放置于被测热源附近,但避免与高功率器件直接接触以免错误读温;为获得稳定读数,应保证周围热阻路径一致。
  • 焊接与回流:遵循 SMD 回流工艺规范,注意元件的湿敏等级与回流曲线;必要时参考厂方关于焊接温度与次数的说明。
  • 机械保护:避免在封装上直接施加应力或过度涂覆导热性强的胶体,防止测量偏差或损伤。

六、可靠性与选型注意事项

  • 数据确认:在最终设计前务必索取并核对厂方完整数据表,确认 25 ℃ 阻值公差、温度系数、最大允许功率、热时间常数、绝缘与寄生参数等关键指标。
  • 老化与漂移:热敏元件长期暴露在极端温度或重复热循环下可能发生阻值漂移,关键应用建议做寿命试验与周期校准。
  • 替代器件:如需更高精度或线性度,可考虑硅温度传感器(线性输出)或热电偶等方案;如需复位式过流保护,应选用专门的 PTC 自恢复保险丝(聚合物 PTC)而非此类测温用 PTC。
  • 采购信息:确认封装(SOT-23/TO‑236AB)、包装方式(卷带)及制造批次,以便批量一致性。

总结:KTY82/220,215(NXP PTC 2 kΩ,SOT-23)适合在体积受限且需快速温度响应的场合作温度监测与过温保护。设计时关注上拉阻值、自发热、校准与封装热耦合,最终以厂方数据表和实际测量验证为准。

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