WMSIC Electronic Components

PCA9685BS,118 PCA9685BS

ModelPCA9685BS,118
PackageHVQFN-28(6x6)
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
NXP PCA9685BS, 118
Type
NXP
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
PCA9685BS,118
Electronic Component
1
Package
HVQFN-28(6x6)
Electronic Component
LEDDriver
Electronic Component
0g
Electronic Component
1
Channel Count
16
Electronic Component
BM0248788252
Switching Frequency
200Hz
Output Voltage
5.5V
Operating Voltage(DC)
2.3V~5.5V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PCA9685BS,118 产品概述

一、概述

PCA9685BS,118 为恩智浦(NXP)推出的 16 通道 LED 驱动器 IC,工作电压范围宽(DC 2.3V–5.5V),通过 I2C 总线进行寄存器级编程和级联控制。器件以线性输出并结合 PWM 调光方式实现每通道最高 25mA 的驱动能力,工作温度范围为 -40℃ 到 +85℃,封装为 HVQFN-28(6×6mm),适合多通道彩色背光、指示灯及小功率照明等应用场景。

二、主要特性

  • 通道数量:16 路独立输出,便于细粒度控制多颜色或多区域灯组。
  • 调光方式:PWM 调光,可实现平滑亮度控制与分时驱动。常用于实现灰度渐变和脉宽控制。
  • 输出能力:每通道线性输出最高可达 25mA,适合驱动一般 LED 及小功率指示灯。
  • 总线接口:标准 I2C/I²C 接口,支持单片或多片级联,便于地址管理与微控制器通信。
  • 电气与环境:工作电压 2.3V–5.5V,工业级温度范围 -40℃ 至 +85℃,可靠性高,适应多种工作环境。
  • 封装:HVQFN-28(6×6mm)小型封装,便于高密度 PCB 布局。

三、典型应用

  • 多通道 RGB/RGBW 背光与面板背光驱动(显示器、键盘、车载仪表)。
  • 指示灯阵列、状态灯与信号指示模块。
  • 小型装饰照明、可编程灯带控制。
  • 需要 I2C 集中控制的多通道灯光系统或测试平台。

四、设计与使用建议

  • 电源与去耦:在 VCC 引脚旁并联低 ESR 电容(如 0.1µF + 1µF)以保证瞬态稳定,避免 PWM 频率抖动。
  • I2C 总线:为 SDA/SCL 使用合适阻值上拉电阻,注意多片级联时地址配置与总线负载。
  • 散热管理:多通道同时在高电流工作时,线性输出会产生显著功耗,建议合理分配点亮通道数、增加 PCB 铜箔散热或局部热沉,必要时降低单通道平均电流以防过热。
  • 输出保护:为提高系统稳健性,可在外设端增加限流或瞬态保护措施;设计时评估总功耗与软件级限制(如最大同时点亮通道数)。
  • 软件控制:通过 I2C 编程实现亮度曲线与渐变算法,结合 PWM 精细调整可实现无频闪视觉效果。

五、封装与可靠性要点

HVQFN-28(6×6)封装有利于占板面积优化,但对焊装工艺、热回流和底部焊盘布局要求较高。推荐参考封装说明书中建议的焊盘尺寸与锡膏模板,保证良好焊接与散热路径。器件额定温度-40℃~+85℃,适合工业与消费类产品,但在高温和高并发驱动场景下应做温升验证与寿命评估。

总结:PCA9685BS,118 提供了集成化的 16 路 PWM 灯控能力,支持低电压驱动与 I2C 集中控制,适用于对多通道亮度控制和软硬件可编程性有较高要求的中低功率照明应用。在系统设计中重点关注功耗与散热管理、I2C 总线规划以及封装焊接工艺,以确保稳定可靠运行。

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