WMSIC Electronic Components

CLRC66301HN,551 CLRC66301HN

ModelCLRC66301HN,551
PackageQFN-32-EP(5x5)
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
NXP CLRC66301HN, 551
Type
NXP
Unit
Electronic Component
Minimum package
490 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
EPC,FeliCa,ISO 14443A,ISO 14443B,ISO 15693,ISO 18000-3,MIFARE,NFC
Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
CLRC66301HN,551
Electronic Component
1
Package
QFN-32-EP(5x5)
Electronic Component
RF Card IC
Electronic Component
0.45g
Frequency
13.56MHz
Electronic Component
1
Electronic Component
106Kbit/s;848Kbit/s;424Kbit/s;212Kbit/s
Features
Data; Built-in Antenna Driver; Low Power
Electronic Component
BM0220387373
Operating Voltage
3V~5.5V
Interface Type
I2C,SPI,UART

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CLRC66301HN,551 产品概述

一、产品背景

在当今快速发展的物联网和无线通信技术背景下,RFID(射频识别)技术已成为许多行业中不可或缺的一部分。RFID技术能够通过无线方式实现非接触式的数据传输,广泛应用于商品追踪、支付系统、身份认证和智慧城市等领域。NXP(恩智浦)作为全球领先的射频技术供应商,推出了CLRC66301HN,551系列RFID阅读器芯片,旨在满足多种复杂应用的需求。

二、产品参数

CLRC66301HN,551是一款高性能的射频卡芯片,具备以下基础参数:

  • 类型:RFID阅读器

  • 工作频率:13.56 MHz

  • 符合标准:

    • ISO 14443:用于非接触式IC卡的标准,广泛应用于智能卡和电子支付。
    • ISO 15693:针对具有更大读取范围的标签标准,适合于数据存储和访问控制的应用。
    • ISO 18000-3:用于RFID频谱管理的标准,支持多种应用场景。
    • MIFARE:特别适用于公共交通、门禁控制及充值式支付系统的非接触式卡片。
    • NFC(近场通信):支持智能手机和小型设备之间的短距离无线通信。
  • 接口类型:产品提供多种可选接口,包括I²C、SPI和UART,方便与微控制器或其他外部系统进行通信。

  • 供电电压:3V至5.5V,适应多种应用场景,提供灵活的电源解决方案。

  • 工作温度范围:-25°C至85°C,适合在极端环境下使用,确保在多样化工业或商业用途中的稳定性。

  • 封装类型:产品采用表面贴装型设计,方便集成与自动化生产。

  • 封装外壳:32-VFQFN(裸露焊盘)封装,便于散热和信号传输。

三、核心功能与优势

CLRC66301HN,551芯片的设计强调高效能和灵活性。其支持多种RFID标准,使其能够与不同类型的射频标签和设备兼容,极大地扩展了应用范围。此外,该芯片集成了多种先进技术,如:

  • 高灵敏度:具备强大的读写性能,确保良好的标签识别能力,可在复杂的环境中维持稳定的工作状态。

  • 多种通信接口:提供I²C、SPI和UART三种接口选择,允许开发人员根据特定应用需求选择最合适的通信方式,确保灵活的系统集成能力。

  • 支持NFC功能:支持近场通信 (NFC),可以与手机及其他NFC设备进行互动,为智能支付、信息分享等应用提供便捷解决方案。

  • 低功耗设计:在保证性能的前提下,优化功耗,使其具有较低的能耗,为电池供电的应用提供更长的使用时间。

四、应用场景

CLRC66301HN,551广泛应用于多个行业,包括但不限于:

  • 智能交通:用于公共交通系统的票务管理及身份认证,提升乘客的出行便捷性。

  • 门禁控制:在安全系统中应用于身份验证,提升企业或公共场所的安全性。

  • 资产管理:在物流和供应链中用于物品的追踪与管理,提高库存准确性和运营效率。

  • 支付系统:在智能支付及电子钱包中提供支持,推动无现金社会的实现。

  • 物联网应用:作为智能家居或工业自动化设备的核心组件,增强设备之间的通信能力。

五、总结

NXP的CLRC66301HN,551是一款具有高度集成化与灵活性的RFID阅读器芯片,凭借其强大的兼容性和多样化的应用场景,能够为各行各业提供理想的解决方案。随着RFID技术的不断发展,CLRC66301HN,551必将在未来的智能应用中扮演更加重要的角色,推动行业创新与升级。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.