Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BGA2867,115 BGA2867
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- NXP BGA2867, 115
- Type
- NXP
- Unit
- Electronic Component
- Minimum package
- 3000 圆盘
Technical parameters
- IP3
- 24dBm
- P1dB
- 5dBm
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- NXP
- Electronic Component
- BGA2867,115
- Electronic Component
- 27.2dB
- Electronic Component
- 1
- Package
- TSSOP-6-1.3mm
- Electronic Component
- RFAmplifier
- Electronic Component
- 0.023g
- Frequency
- 0Hz~2.2GHz
- Electronic Component
- 1
- Features
- Linear
- Electronic Component
- BM0265849850
- Noise Figure
- 3.8dB
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BGA2867,115通用射频放大器产品概述
一、产品定位与核心价值
BGA2867,115是恩智浦（NXP）推出的通用型射频放大器，核心覆盖0Hz至2.2GHz宽频率范围，兼顾低噪声、稳定增益与宽电压供电特性，无需额外分频模块即可适配多频段系统，是工业、通信、测试仪器领域的高性价比选择。
二、关键性能参数详解
该器件核心性能经2.15GHz测试频率验证，关键指标适配射频链路核心需求：
- 频率覆盖：0Hz~2.2GHz（直流至微波频段），可兼容2G/3G/4G、ISM、卫星通信等多频段信号，减少硬件复杂度；
- 增益特性：典型增益27.2dB，宽频段内增益平坦度稳定，满足射频链路对信号强度的补偿需求；
- 线性度：P1dB（1dB压缩点）为5dBm，线性输出能力适配中等功率场景，避免非线性失真；
- 噪声性能：噪声系数3.8dB，低噪声特性可有效降低接收链路的噪声累积，提升系统信噪比；
- 供电与功耗：支持4.5V~5.5V宽电压输入，典型工作电流20.1mA，低功耗设计适配电池供电或低功耗系统。
三、封装与安装特性
- 封装形式：采用6-TSSOP封装（兼容SC-88、SOT-363规范），体积紧凑，适合高密度PCB布局；
- 安装方式：表面贴装型（SMT），适配自动化生产流程，降低人工成本与安装误差，提升批量生产效率。
四、典型应用场景
依托恩智浦的可靠性验证，该器件广泛应用于：
- 无线通信：2G/3G/4G/LTE基站射频前端、小基站（pico/femto）增益补偿；
- ISM频段：蓝牙、Wi-Fi、ZigBee等无线设备的射频前端放大；
- 测试仪器：信号发生器、频谱分析仪、矢量网络分析仪的射频放大模块；
- 工业无线：工业无线传感器网络（WSN）、远程监控系统的射频链路；
- 卫星通信辅助：卫星地面站多频段信号的辅助放大环节。
五、产品优势总结
BGA2867,115的核心优势在于：宽频率覆盖（直流至2.2GHz）、低噪声与稳定增益、宽电压供电、小体积封装，同时依托恩智浦的品牌可靠性，可满足不同领域射频系统的多样化需求，是一款高性价比的通用射频放大器件。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
