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BAP64-04W,115 BAP64
Configuration
1 options
Configuration
23+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- NXP BAP64-04W, 115
- Type
- NXP
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- NXP
- Electronic Component
- BAP64-04W,115
- Electronic Component
- 1
- Package
- SOT-23-6
- Electronic Component
- PINDiode
- Electronic Component
- 0.022g
- Electronic Component
- 1
- Electronic Component
- BM0253008918
- Current
- 100mA
- Diode
- 1
- Current(Ir)
- 10uA@60V
- (Vf)
- 1.1V@50mA
- Electronic Component
- 65℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BAP64-04W,115 产品概述
一、简介
BAP64-04W,115 是恩智浦（NXP）推出的一款通用二极管器件，内部为一对串联二极管，采用 SOT-23-6 小型封装，面向体积受限且需要中等耐压与低泄漏电流的电子设计场景。器件结合了较低的正向压降与高达 100V 的反向耐压特性，适合信号整流、过压钳位与一般功率隔离等应用。
二、主要电气参数
- 二极管配置：1 对串联式（两只二极管串联结构）
- 正向压降 Vf：1.1V @ 50mA（中等电流工作下的压降性能）
- 直流反向耐压 Vr：100V（单体或串联结构在反向施加时的最高额定电压）
- 整流电流 IF：100mA（连续正向电流能力，适用于小功率整流）
- 反向电流 Ir：10 μA @ 60V（低泄漏，利于高阻抗或高压节点使用）
- 工作结温范围：-65 ℃ ～ +150 ℃（宽温区可靠工作）
三、封装与机械特性
器件封装为 SOT-23-6，具有体积小、可焊性好、适合自动贴片生产的优点。SOT-23-6 的多引脚布局也便于在印刷电路板上进行串联、并联或与其他元件紧凑配合布线。SOT-23-6 适合消费类、工业控制和通信设备中对空间与成本敏感的设计。
四、典型应用
- 小功率整流与电源二次侧保护（低至中等电流负载）
- 信号钳位、过压保护与电平移位电路
- 便携设备、传感器接口及电池管理中的保护或隔离元件
- 工业与通信设备中用于高阻抗节点的低泄漏二极管需求
五、使用与注意事项
- 在接近或超过规格 IF=100mA 的工作点时需关注器件的功耗与散热，SOT-23-6 封装散热受限，建议在 PCB 布局中预留散热铜箔或使用并联方案以降低结温。
- 反向电压应保持在 Vr=100V 以内，且在高压应用中留有裕量以增强可靠性。
- 在高温或高应力环境下长期使用，请依据器件的结温范围（-65 ℃ ～ +150 ℃）进行热设计与可靠性评估。
- 若电路对反向泄漏极为敏感，可在设计时考虑添加辅助屏蔽或选择额外的温度补偿措施。
六、结论
BAP64-04W,115 提供了在小封装下兼顾中等正向压降、较高反向耐压与低反向泄漏的均衡特性，适合对体积、成本和可靠性有要求的通用整流与保护应用。设计时注意封装散热与工作点限制，可在消费电子、工业控制与通信终端中发挥良好作用。
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